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   Multiproject Wafer (MPW) and Prototyping Service

 

IHP offers research partners and customers access to its powerful 0.25 µm SiGe BiCMOS technologies.

 

The technologies are especially suited for applications in the higher GHz bands (e.g. for wireless, broadband, radar). They provide integrated HBTs with cut-off frequencies of up to 220 GHz and integrated RF LDMOS devices with breakdown voltages of up to 33 V, including complementary devices.

 

The Following four technologies are available:

 

SG25H1:

A high-performance technology with npn-HBTs up to fT/fmax= 180/220 GHz.

SG25H2:

A complementary high-performance technology with npn-HBTs similar to SG25H1 and additional pnp-HBTs with fT/fmax= 90/120 GHz.

SG25H3:

A technology with a set of npn-HBTs, ranging from a high RF performance (fT/fmax= 110 GHz/180 GHz) to higher breakdown voltages up to 7 V.

SGB25VD:

A cost-effective technology with a set of npn-HBTs up to a breakdown voltage of 7 V. A distinctive feature of this technology is additional integrated complementary RF LDMOS devices with breakdown voltages up to 33 V.

 

From 2008 IHP will offer access to its next generation 0.13 µm BiCMOS technology. This technology will include integrated HBTs with cut-off frequencies of up to 300 GHz.

 

The schedule for MPW & Prototyping runs is available.

 

A cadence-based mixed signal design kit is available. For high frequency designs an analogue Design Kit in ADS can be used. IHP’s reusable blocks and IPs for wireless and broadband are offered to support designs.

 

   Technical key-parameters of the technologies offered for
       MPW & Prototyping are:

 

1. High-Performance 0.25 µm SiGe BiCMOS (SG25H1)

 

Parameter

npn1

npn2

Bipolar Section

AE

0.21 x 0.84 µm2

0.18 x 0.84 µm2

Peak fmax

190 GHz

220 GHz

Peak fT

190 GHz

180 GHz

BVCE0

1.9 V

1.9 V

BVCB0

4.5 V

4.5 V

VA

40 V

40 V

ß

200

200

 

2. Complementary High-Performance 0.25 µm SiGe BiCMOS (SG25H2)

 

Parameter

npn

pnp

Bipolar Section

AE

0.21 x 0.84 µm2

Peak fmax

170 GHz

120 GHz

Peak fT

170 GHz

90 GHz

BVCE0

1.9 V

-2.5 V

BVCB0

4.5 V

-4.0 V

VA

40 V

30 V

ß

160

100

 

3. 0.25 µm SiGe BiCMOS with a set of npn-HBTs, ranging from high RF performance to

    high breakdown voltages (SG25H3)

 

Parameter

High Performance 1

High Performance 2

Medium Voltage

High Voltage

Bipolar Section

AE

0.22 x 0.84 µm2

0.42 x 0.84 µm2

0.22 x 2.24 µm2

0.22 x 2.24 µm2

Peak fmax

180 GHz

140 GHz

140 GHz

80 GHz

Peak fT

110 GHz

120 GHz

45 GHz

30 GHz

BVCE0

2.3 V

2.3 V

5 V

>7 V

BVCB0

6.0 V

6.0 V

15.5 V

21.0 V

VA

30 V

ß

150

 

4. 0.25 µm SiGe BiCMOS with High-Voltage Devices (SGB25VD)

 

Parameter

High Performance

Standard

High Voltage

Bipolar Section

AE

0.42 x 0.84 µm2

Peak fmax

95 GHz

90 GHz

70 GHz

Peak fT

75 GHz

45 GHz

25 GHz

BVCE0

2.4 V

4.0 V

7.0 V

BVCB0

>7 V

>15 V

>20 V

VA

>50 V

>80 V

>100 V

ß

190


LDMOS Section

 

n-LDMOS

p-LDMOS

 

n-LDMOS

23

n-LDMOS 13

n-LDMOS I10****

p-LDMOS 8

p-LDMOS12

BVDSS*

26 V

15 V

11.5 V

-10 V

-13.5 V

IDsat**

140 µA/µm

(VGS = 1.5 V)

140 µA/µm

(VGS = 1.5 V)

175 µA/µm

(VGS = 1.5 V)

85 µA/µm

(VGS = -1.5 V)

90 µA/µm

(VGS = -1.5 V)

Ileakage

< 15 pA/µm

(VDS = 20 V)

< 15 pA/µm

(VDS = 10 V)

< 15 pA/µm

(VDS = 8V)

< 50 pA/µm

(VDS = -8 V)

< 50 pA/µm

(VDS = -8 V)

RON

11 Ωmm

7 Ωmm

7.5 Ωmm

16 Ωmm

11.5 Ωmm

Peak fmax***

40 GHz

43 GHz

46 GHz

25 GHz

22 GHz

Peak fT***

19 GHz

23 GHz

21 GHz

11 GHz

11 GHz

* : @100 pA/µm, **: @ VDS = 5 V , *** : @ VDS= 4 V, **** : substrate isolated

An additional n-LDMOS with BVDSS of 33 V is available.

 

CMOS and Passives of 0.25 µm Technologies

 

Parameter

SG25H1 - H3

SGB25VD

CMOS Section (0.25 µm)

Core Supply Voltage

2.5 V

nMOS Vth

0.6 V

nMOS IDsat

540 µA/µm

570 µA/µm

nMOS Ioff

3 pA/µm

pMOS Vth

-0.56 V

-0.51 V

pMOS IDsat

230 µA/µm

290 µA/µm

pMOS Ioff

3 pA/µm

Passives

MIM Capacitor

1 fF/µm2

N+ Poly Resistor

210 Ω/

P+ Poly Resistor

280 Ω/

310 Ω/

High Poly Resistor

1600 Ω/

2000 Ω/

Varactor Cmax/Cmin

3

Inductor Q@2.4 GHz

12 (1 nH), 6 (15 nH)

Inductor Q@5.8 GHz

16 (1 nH), 10 (2 nH)

 

5. An Additional 0.13 µm BiCMOS With the Following Scheduled Parameters Will be

    Available From 2008

 

Parameter

npn13P

npn13V

Bipolar Section

AE

0.12 x 0.48 µm2

0.12 x 0.48 µm2

Peak fmax

300 GHz

120 GHz

Peak fT

250 GHz

45 GHz

BVCE0

1.7 V

4 V

BVCB0

5.5 V

16 V

ß

500

450




print version



06-05-08
7th Workshop
High-Performance SiGe:C BiCMOS (September 17, 2008) and Tutorial IHP Design Kits (September 18-19, 2008)

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