Multiproject Wafer (MPW) and Prototyping Service
IHP offers research partners and customers access to its powerful 0.25 µm SiGe BiCMOS technologies.
The technologies are especially suited for applications in the higher GHz bands (e.g. for wireless, broadband, radar). They provide integrated HBTs with cut-off frequencies of up to 220 GHz and integrated RF LDMOS devices with breakdown voltages of up to 33 V, including complementary devices.
The Following four technologies are available:
A high-performance technology with npn-HBTs up to fT/fmax= 180/220 GHz. | |
A complementary high-performance technology with npn-HBTs similar to SG25H1 and additional pnp-HBTs with fT/fmax= 90/120 GHz. | |
A technology with a set of npn-HBTs, ranging from a high RF performance (fT/fmax= 110 GHz/180 GHz) to higher breakdown voltages up to 7 V. | |
A cost-effective technology with a set of npn-HBTs up to a breakdown voltage of 7 V. A distinctive feature of this technology is additional integrated complementary RF LDMOS devices with breakdown voltages up to 33 V. |
From 2008 IHP will offer access to its next generation 0.13 µm BiCMOS technology. This technology will include integrated HBTs with cut-off frequencies of up to 300 GHz.
The schedule for MPW & Prototyping runs is available.
A cadence-based mixed signal design kit is available. For high frequency designs an analogue Design Kit in ADS can be used. IHP’s reusable blocks and IPs for wireless and broadband are offered to support designs.
Technical key-parameters of the technologies offered for
MPW & Prototyping are:
1. High-Performance 0.25 µm SiGe BiCMOS (SG25H1)
Parameter |
npn1 |
npn2 |
Bipolar Section |
||
AE |
0.21 x 0.84 µm2 |
0.18 x 0.84 µm2 |
Peak fmax |
190 GHz |
220 GHz |
Peak fT |
190 GHz |
180 GHz |
BVCE0 |
1.9 V |
1.9 V |
BVCB0 |
4.5 V |
4.5 V |
VA |
40 V |
40 V |
ß |
200 |
200 |
2. Complementary High-Performance 0.25 µm SiGe BiCMOS (SG25H2)
Parameter |
npn |
pnp |
Bipolar Section |
||
AE |
0.21 x 0.84 µm2 |
|
Peak fmax |
170 GHz |
120 GHz |
Peak fT |
170 GHz |
90 GHz |
BVCE0 |
1.9 V |
-2.5 V |
BVCB0 |
4.5 V |
-4.0 V |
VA |
40 V |
30 V |
ß |
160 |
100 |
3. 0.25 µm SiGe BiCMOS with a set of npn-HBTs, ranging from high RF performance to
high breakdown voltages (SG25H3)
Parameter |
High Performance 1 |
High Performance 2 |
Medium Voltage |
High Voltage |
Bipolar Section |
||||
AE |
0.22 x 0.84 µm2 |
0.42 x 0.84 µm2 |
0.22 x 2.24 µm2 |
0.22 x 2.24 µm2 |
Peak fmax |
180 GHz |
140 GHz |
140 GHz |
80 GHz |
Peak fT |
110 GHz |
120 GHz |
45 GHz |
30 GHz |
BVCE0 |
2.3 V |
2.3 V |
5 V |
>7 V |
BVCB0 |
6.0 V |
6.0 V |
15.5 V |
21.0 V |
VA |
30 V |
|||
ß |
150 |
|||
4. 0.25 µm SiGe BiCMOS with High-Voltage Devices (SGB25VD)
Parameter | High Performance | Standard | High Voltage |
Bipolar Section | |||
AE | 0.42 x 0.84 µm2 | ||
Peak fmax | 95 GHz | 90 GHz | 70 GHz |
Peak fT | 75 GHz | 45 GHz | 25 GHz |
BVCE0 | 2.4 V | 4.0 V | 7.0 V |
BVCB0 | >7 V | >15 V | >20 V |
VA | >50 V | >80 V | >100 V |
ß | 190 | ||
LDMOS Section |
|||||
|
n-LDMOS |
p-LDMOS |
|||
|
n-LDMOS 23 |
n-LDMOS 13 |
n-LDMOS I10**** |
p-LDMOS 8 |
p-LDMOS12 |
BVDSS* |
26 V |
15 V |
11.5 V |
-10 V |
-13.5 V |
IDsat** |
140 µA/µm (VGS = 1.5 V) |
140 µA/µm (VGS = 1.5 V) |
175 µA/µm (VGS = 1.5 V) |
85 µA/µm (VGS = -1.5 V) |
90 µA/µm (VGS = -1.5 V) |
Ileakage |
< 15 pA/µm (VDS = 20 V) |
< 15 pA/µm (VDS = 10 V) |
< 15 pA/µm (VDS = 8V) |
< 50 pA/µm (VDS = -8 V) |
< 50 pA/µm (VDS = -8 V) |
RON |
11 Ωmm |
7 Ωmm |
7.5 Ωmm |
16 Ωmm |
11.5 Ωmm |
Peak fmax*** |
40 GHz |
43 GHz |
46 GHz |
25 GHz |
22 GHz |
Peak fT*** |
19 GHz |
23 GHz |
21 GHz |
11 GHz |
11 GHz |
* : @100 pA/µm, **: @ VDS = 5 V , *** : @ VDS= 4 V, **** : substrate isolated |
|||||
An additional n-LDMOS with BVDSS of 33 V is available. |
|||||
CMOS and Passives of 0.25 µm Technologies
Parameter |
SG25H1 - H3 |
SGB25VD |
CMOS Section (0.25 µm) |
||
Core Supply Voltage |
2.5 V |
|
nMOS Vth |
0.6 V |
|
nMOS IDsat |
540 µA/µm |
570 µA/µm |
nMOS Ioff |
3 pA/µm |
|
pMOS Vth |
-0.56 V |
-0.51 V |
pMOS IDsat |
230 µA/µm |
290 µA/µm |
pMOS Ioff |
3 pA/µm |
|
Passives |
||
MIM Capacitor |
1 fF/µm2 |
|
N+ Poly Resistor |
210 Ω/ |
|
P+ Poly Resistor |
280 Ω/ |
310 Ω/ |
High Poly Resistor |
1600 Ω/ |
2000 Ω/ |
Varactor Cmax/Cmin |
3 |
|
Inductor Q@2.4 GHz |
12 (1 nH), 6 (15 nH) |
|
Inductor Q@5.8 GHz |
16 (1 nH), 10 (2 nH) |
|
5. An Additional 0.13 µm BiCMOS With the Following Scheduled Parameters Will be
Available From 2008
Parameter |
npn13P |
npn13V |
Bipolar Section |
||
AE |
0.12 x 0.48 µm2 |
0.12 x 0.48 µm2 |
Peak fmax |
300 GHz |
120 GHz |
Peak fT |
250 GHz |
45 GHz |
BVCE0 |
1.7 V |
4 V |
BVCB0 |
5.5 V |
16 V |
ß |
500 |
450 |