Overview >>                      MPL - Modular Processor Library

 

The Objective The project is used internally to develop a library of verified and re-usable modules based on the IHP BiCMOS (SiGe:C) technology. The focus are low-power processors and multi-processor solutions for high performance wireless communication systems. Further emphasis is placed on radiation-hard components for applications in space.
Additional design support is given to customers in developing reliable systems in short time.

Motivation The MPL project will enable powerful and competitive system-on-chip solutions which can be implemented very flexible and very fast according to actual market requirements.

Results Within the project a design flow is developed to design and implement modules and systems in a hierarchical library under suitable version control management tool.

Funding The project is founded by IHP.

Project Partners - German Aerospace Center (radiation-hard processor)
- Aeroflex Gaisler AB (Leon processor cores and components)
- Genesys Ltd., Ukraine (memory generators)
- Humboldt University of Berlin (PCB designs)
- IHP GmbH (chip production and measurement)
EDA and SW tool partners (selection):
- Cadence Design Systems Inc. (simulation, layout design)
- Mentor Graphics Inc. (simulation, layout design)
- Perforce Software Inc. (version control management)
- Synopsys Inc. (net list synthesis)

Customers IHP GmbH (several internal customer projects)