Overview >> Integrated Surface Acoustic Wave (SAW) Devices
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The Objective
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The project aims to develop SAW devices based on piezoelectric layer systems which can be integrated in the back end of line (BEOL) process stream of mainstream Si microelectronic technologies (CMOS etc). For this purpose, the growth of a high-quality piezoelectric film with the desired crystallographic orientation must be achieved under BEOL constraints (thermal budget etc.). The integration of such SAW Interdigital Transducers (IDT) is of high interest for on-chip solutions in wireless communication and bio-molecular sensor array applications. more
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IHP’s Contribution
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0.13 µm IHP BiCMOS technology enables the processing of SAW filters in the frequency range from several MHz up to 5 GHz.
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Funding
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This project is funded by IHP (external funding has been requested).
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Project Partners
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IHP, Paul-Drude-Institute Berlin, TeleBITcom
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Selected Publications
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project started in 2007
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