Overview >> WIGWAM - Wireless Gigabit with Advanced Multimedia Support
| IHP’s Objectives |
making use of RF circuits based on the IHP BiCMOS (SiGe:C) technology. communication; Verify function and performance of the system with a demonstrator. |
| IHP’s Contribution |
Design and Implementation of an Ultra High-Speed WLAN: Concept, SoC-Implementation and Demonstrator (WIGWAM-IHP) The following main aspects will be investigated at IHP: The focus is on the design and implementation of a 60 GHz transceiver using SiGe:C BiCMOS technology. We will investigate OFDM-baseband architectures which support data rates up to 1 Gbps. The architectures have to facilitate a cost efficient implementation of the baseband unit. Flexibility and adaptability of the designs should allow the customization of the baseband processor for a wide range of applications. Important topics are the definition of efficient and robust strategies for synchronization and channel estimation. The desired data rate of 1 Gbps requires very efficient algorithms and architectures for the protocol processor. Based on high-level algorithmic models, we will identify operations that should be executed in hardware. For the implementation of the protocol processor we will focus on standard microcontrollers supported by customized hardware accelerators. The price of products can be reduced when as many components as possible are integrated into a single chip. This brings about the problem of interference between digital and analog components (EMC, crosstalk). Using Globally Asynchronous, Locally Synchronous (GALS) design techniques can contribute to reducing problems associated with EMC and crosstalk. Furthermore, clock distribution and RTL-level synchronization problems are alleviated. We want to investigate and quantify the effects GALS techniques have on a complex circuit block like the baseband processor. Only a demonstrator can convince suppliers and users of a new technology of its benefits. Therefore, we have committed ourselves to implementing a complete demonstrator, transmitting data at 1 Gbps in the 60 GHz band. It will consist of own developed modules as well as commercially available components. By defining clear interfaces between the major blocks, we will give our project partners the opportunity to test their own developed components using our demonstrator. |
| Funding | This project is funded by the German Federal Ministry of Education and Research (BMBF). |
| Project Partners | Alcatel SEL AG - Forschungszentrum Stuttgart, DaimlerChrysler AG - Forschungszentrum Ulm, Infineon Technologies AG - Abt. SMS TI RF 1 Ulm, MEDAV GmbH, Nokia GmbH, Philips GmbH - Forschungslaboratorien Aachen, Siemens AG Communications (Com MN PG NT RI 4 - Future Radio), Telefunken Radio Communication Systems GmbH und Co. KG, Dresden University of Technology (Project Coordination and Management) |
| Project Homepage | www.wigwam-project.com |
| Selected Publications |
Please check also: http://www.wigwam-project.de/publications/index.html Draft PHY Proposal for 60 GHz WPAN E. Grass, M. Piz, F. Herzel, R. Kraemer Presentation for IEEE 802.15.3c, Document Number IEEE 802.15-05/0634r1, Vancouver (Canada), November 2005. Frequency Synthesis for 60 GHz OFDM Systems F. Herzel, M. Piz and E. Grass Proceedings 10th International OFDM Workshop (InOWo’05), Hamburg (Germany), pp. 303-307, Aug. 2005. Implementation Aspects of Gbit/s Communication System for 60 GHz Band E. Grass, F. Herzel, M. Piz, Y. Sun and R. Kraemer Proceedings of the 14th Wireless World Research Forum (WWRF 14), San Diego, July 2005. Paving the Way for Gigabit Networking J. P. Ebert, E. Grass, R. Irmer, R. Kraemer, G. Fettweis, K. Strom, G. Trankle, W. Wirnitzer, R. Witmann, H. Reumerman, E. Schulz, M. Weckerle, P. Egner and U. Barth IEEE Communications Magazine, Vol. 43 (4), pp. 27-30, April 2005. A Fully Integrated BICMOS PLL for 60 GHz Wireless Applications W. Winkler, J. Borngräber, B. Heinemann, F. Herzel ISSCC 2005, San Francisco, CA, pp.406-407, February 9, 2005. 60 GHz Transceiver Circuits in SiGe:C BiCMOS Technology W. Winkler, J. Borngräber, H. Gustat, and F. Korndörfer Proceedings of the 30th European Solid-State Circuits Conference, Leuven, Belgium, pp. 83-86, 20.-24. September 2004. |

