Overview >> Pilot Line
| Goals | World - class prototyping and process R&D capability in wireless & broadband technologies |
| Motivation |
Circuit innovation requires stable baseline process. Short fabrication times are required for high technology innovation speed. |
| Milestones |
Introduction and installation of full 0.13µm BiCMOS process capability in the pilot line. Delivery Silicon on time for the technology projects ”0.25µm BiCMOS”, “MPW & Prototyping”, “LDMOS”, “Glucosesensor” and “Flash Integration” (after agreement about capacity and schedule between CR project and technology projects ). Delivery Silicon for engineering and manufacturing for external customers. Delivery wafers for four technologies (with several options) for the project “Shuttle Service” (Fab out): March 03, 09, 15: Delivery wafers “Shuttle Service Jan 17” June 18, 22: Delivery wafers “Shuttle Service May 02” Sept/Oct 24, 28 04: Delivery wafers “Shuttle Service August 08” Dec 03, 07: Delivery wafers “Shuttle Service Oct 17” Jun 20 : Delivery of various project lot for IEDM-papers October: Certification DIN EN ISO 9001:2000 |
| Definition of Success |
Customers satisfaction-delivery on time for all technology projects and MPW in quality and quantity.
Accepted paper for IEDM based on processed wafers in the cleanroom. Fab parameters are depending on annual budget - Throughput equivalent of 40 waferstarts/week in 0.25μm-BiCMOS - technology - 85% up time for toolset, characterized by MTTR <12h for 80% and >24h for 4% - Cycle time: 3 days/mask for frozen technologies with standard priority, less than 2 days/mask for frozen technologies with high priority |