Technical Basis
The following tools are currently being used:
Thin Film Growth and Treatment Facilities
Molecular Beam Epitaxy (MBE), Molecular Organic Chemical Vapour Deposition (MO-CVD) and Rapid Thermal Annealing (RTA), Metallization Chamber
Spectroscopy
Micro-Raman-Spektroscopy, X-ray photoelectron spectroscopy (XPS), Ultraviolet photoelectron spectroscopy (UPS), Scanning Nanoprobe Auger electron spectroscopy (AES), Sputter-XPS, Time-of-flight Secondary Mass Ion Spectroscopy (Tof-SIMS), Dynamic SIMS, Synchrotron Radiation-XPS (Bessy II)
Diffraction
Low Energy Electron Diffraction (LEED), Reflection High Energy Electron Diffraction (RHEED) equipped with video registration, High Resolution X-ray Diffraction (HR-XRD), X-ray Reflectometry (XRR), Synchrotron Radiation Grazing Incidence X-ray diffraction (GI-XRD) (ESRF) (ANKA) (HasyLab)
Microscopy
Variable Temperature Scanning Tunneling Microscopy (VT-STM), Combined Scanning Tunnelling Microscopy (STM) and Atomic Force Microscopy (AFM), Photoelectron Emission Microscopy (PEEM), Transmission Electron Microscopy (TEM), Dual Focussed Ion Beam – Scanning Electron Microscope (Dual FIB SEM)
Electrical Characterization
Capacitance versus voltage (C-V), Current versus voltage (J-V), Variable temperature current versus voltage & dielectric relaxation & oxygen partial pressure studies (Vacuum prober SUSS MicroTec PMV200), Hall–Device, Charge Carriere Life Time Facility, Conductive AFM
Further methods are available upon request.
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