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   Technical Competencies of the Technology Department

 


IHP is equipped with all the competencies necessary for developing and running world-class BiCMOS technologies:

• SiGe:C HBTs and their integration into CMOS technologies

• Process integration

• Modular extension of standard CMOS technologies

• Device physics and modelling

• Process module and process step research and development  

• Electrical measurements including RF tests

• Diagnostic and analytical techniques necessary for developing and

   running technologies

• Reliability and process qualification

• Ensuring stable and reliable processing in a class 1 clean room in

   24/7 mode

• MPW & Prototyping service for internal and external partners

• Design Kit support for internal and external projects

• Transfer of technologies and technology modules from and to industrial

   partners

• Integrating new materials into technologies




print version



06-05-08
7th Workshop
High-Performance SiGe:C BiCMOS (September 17, 2008) and Tutorial IHP Design Kits (September 18-19, 2008)

[more]


15-04-08
European Consortium to push the speed limit of silicon based transistor up to 0.5 TeraHertz[more]


25-03-08
7th Meeting of GMM Competence Group
“Process control, Inspection and Analytics”

IHP has organized on 06.03.2008 the ... [more]


16-11-07
IEEE International Electron Devices Meeting (IEDM 2007)
Washington, DC
December 10-12, 2007 [more]


04-09-07
6th Workshop
High-Performance SiGe BiCMOS (September 10, 2007) and Tutorial IHP Design Kits (September 11-12, 2007)

[more]


30-08-07
Long Term Research Cooperation Between Taiwanese National Nano Device Laboratories and IHP
Frankfurt (Oder)/Hsinchu, August 24th, 2007: Today the National Nano Device Laboratories located in ... [more]