Hybrid THz & Photonic Technology

The possibilities of heterointegration for the development of new hybrid THz and photonic technologies will be explored within this competence area. For this purpose, wafer-level and chip-based integration techniques are used for 8” wafer platforms to develop advanced THz and photonic systems. In addition, the heterointegration capabilities can also be used for the development of RF interposers and novel RF packaging technologies, as well as the integration of high-Q passive devices for demanding RF applications.