[64]

Low-loss, Low-cost, IC-to-Board Bondwire Interconnects for Millimeter-Wave applications

Gang Liu, Andreas Trasser, A. Cagri Ulusoy, and Hermann Schumacher

The paper will be presented at the coming International Microwave Symposium, Baltimore, 2011 ( IMS 2011 online ).

Abstract: This paper presents a low-cost, low-loss solution for IC-to-board interconnects using bondwires. With an L-C-L structure to compensate the influence of bondwires, low insertion loss and high return loss can be achieved. Optimized at 60 GHz, an insertion loss of 0.1 dB is achieved for the differential connection and 0.3 dB is achieved for the single-ended connection, with additional radial stubs to compensate the influence of the ground bondwire. The 1-dB bandwidth of the interconnect is larger than 10 GHz (16% relative bandwidth at 60 GHz). The low-cost and low-loss characteristic makes the interconnect well suited for millimeter-wave packaging and module design.

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Publications Publications, alphabetical order Publications 2008 Publications 2009 Publications 2010 Publications 2011 ICC 2009 PR 01/2009 Final Presentation	[64] Low-loss, Low-cost, IC-to-Board Bondwire Interconnects for Millimeter-Wave applications Gang Liu, Andreas Trasser, A. Cagri Ulusoy, and Hermann Schumacher The paper will be presented at the coming International Microwave Symposium, Baltimore, 2011 ( IMS 2011 online ). Abstract: This paper presents a low-cost, low-loss solution for IC-to-board interconnects using bondwires. With an L-C-L structure to compensate the influence of bondwires, low insertion loss and high return loss can be achieved. Optimized at 60 GHz, an insertion loss of 0.1 dB is achieved for the differential connection and 0.3 dB is achieved for the single-ended connection, with additional radial stubs to compensate the influence of the ground bondwire. The 1-dB bandwidth of the interconnect is larger than 10 GHz (16% relative bandwidth at 60 GHz). The low-cost and low-loss characteristic makes the interconnect well suited for millimeter-wave packaging and module design.