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VHiSSi

Very High Speed Data Interfaces

Objective

  • Provide multi-Gbit/s serial data-link technology, essential for future spacecraft onboard data-handling systems.
  • Provide a complete solution for spacecraft onboard data-links and networks.
  • Use a European semiconductor fabrication facility and provide corresponding radiation tolerant library.

IHP`s Contribution

  • Defining implementation specs
  • Supporting chip design and library generation
  • Chip fabrication in IHP 0.13 um technology
  • Functional verification of the chip

Funding

EU FP7 Call: Critical Space Technologies: Very High Speed Serial Interfaces
(SPA.2011.2.2-02)

Project Partners

  • University of Dundee (UK) / coordinator
  • STAR-Dundee Ltd (UK)
  • ACE-IC Ltd (ISR)
  • Ramon Chips Ltd (ISR)
  • EADS Astrium GmbH (D)
  • Euro Instruments Trading s.r.l. (IT)
Das Gebäude und die Infrastruktur des IHP wurden finanziert vom Europäischen Fonds für regionale Entwicklung, von der Bundesregierung und vom Land Brandenburg.