• Start
  • Research print
  • Technologies for Smart Systems print
  • Former Projects print
  • HELIOS

HELIOS

Photonics Electronics functional Integration on CMOS

Zielstellung

Photonics on CMOS is a candidate technology for applications where functional integration is needed for improving system performance while reducing size and cost. Functional demonstration of basic building blocks such as a µlaser, a detector, coupling, and link has been realized in previous research projects. As a next step the HELIOS project proposes to integrate photonics components with integrated circuits as a joint effort of major players of the European CMOS Photonics community, in order to enable an integrated design and fabrication chain that can be transferred to EU manufacturers. The objective of the project HELIOS is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics fabrication processes.

Beitrag des IHP

Build and characterize a demonstrator for a discrete Si modulator at 10 Gbps and 40 Gbps integrated with SiGe CMOS technology.

Finanzierung

This project has received funding from the European Union.

Das Gebäude und die Infrastruktur des IHP wurden finanziert vom Europäischen Fonds für regionale Entwicklung, von der Bundesregierung und vom Land Brandenburg.