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PHOIBOS

Photonische Wirebonds für optische Multi-Chip-Systeme

Zielstellung

PHOIBOS studies and develops a novel opto-electronic assembly technology, so called photonic wirebonds, which will allow for implementation of a novel generation of highly integrated optoelectronic systems. Such systems are key to overcome transmission bottlenecks in large-scale data centers, optical access networks, and high-performance computing. Photonic wire bonds connect integrated photonic circuits across chip boundaries. The concept exploits direct-write multi-photon lithography for in-situ fabrication of three-dimensional freeform waveguides.

Beitrag des IHP

IHP develops silicon photonic building blocks and the optical interface to photonic wirebonds in IHP’s photonic integrated circuit technology. Best coupling to photonic wirebonds is achieved by un-cladded inverse taper structures, which requires dedicated process development for the interface.

Finanzierung

This project has received co-funding from the German ministry of research and education (BMBF), project no. 13N12578.

Projektpartner

  • Karlsruhe Institute of Technology / Institute of Photonics & Quantum Electronics (IPQ)
  • Carl Zeiss AG
  • Nanoscribe GmbH
  • Fraunhofer Heinrich-Hertz Institut (HHI)
  • FCI Deutschland GmbH
  • Alcatel-Lucent Deutschland    
  • IBM Research (Switzerland)
Das Gebäude und die Infrastruktur des IHP wurden finanziert vom Europäischen Fonds für regionale Entwicklung, von der Bundesregierung und vom Land Brandenburg.