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Präsentationen 2019

Medizinisch-Psychologische Gesellschaft der MHB Fontane, Neuruppin, Germany
Künstliche Intelligenz – Computer nach dem Vorbild des menschlichen Gehirns
Ch. Wenger (invited)

49th European Microwave Conference (EuMC 2019), Paris, September 29 - October 04, 2019, France
Experimental Evaluation of a 60 GHz Beamforming Solution with 32-Dipole Printed Array
N. Maletic, A. Malignaggi, B. Antonovici, J. Bozmarov, M. Elkhouly, J. Gutierrez Teran, V. Petrovic, E. Grass

7th International Symposium on Integrated Functionalities (ISIF 2019), Dublin, August 11 - 14, 2019, Ireland
Memristive Stochastic Learning for Neuromorphic Computing
M. Ziegler, H. Kohlstedt, Ch. Wenger (invited)

IEEE Photonics Society Summer Topicals Meeting Series 2019, Fort Lauderdale (FL), July 08 - 10, 2019, USA
Intrasubband and Interband Transitions in n-type Ge/SiGe MQW
G. Capellini (invited)

IEEE International Symposium on Antennas and Propagation (APS 2019), Atlanta, July 07 - 12, 2019, USA
A Compcat Efficient D-Band Micromachined On-Chip Differential Patch Antenna for Radar Applications
W. Ahmad, M. Kucharski, D. Kissinger, H.J. Ng

Conference on Insulating Films on Semiconductors (INFOS 2019), Cambridge, June 30 - July 03, 2019, England
Analysis of the Statistics of Device-to-Device and Cycle-to-Cycle Variability in TiN/Ti/Al:HfO2/TiN RRAMs
E. Perez, D. Maldonado, C. Acal, J.E. Ruiz-Castro, F.J. Alonso, A.M. Aguilera, F. Jimenez-Molinos, Ch. Wenger, J.B. Roldan

Progress In Electromagnetics Research Symposium (PIERS 2019), Rome, June 17 - 20, 2019, Italy
Functionalized materials for integrated photonics: Hybrid integration of organic materials in silicon-based photonic integrated circuits for advanced optical modulators and light-sources
P. Steglich, Ch. Mai, S. Bondarenko, C. Villringer, S. Pulwer, C. Zesch, B. Dietzel, S. Schrader, F. Vitale, F. De Matteis, M. Casalboni, A. Mai (invited)

22nd International Conference on Solid State Ionics (SSI 2019), PyeongChang, June 16 - 21, 2019, South Korea
Memristive Stochastic Learning for Neuromorphic Computing
M. Ziegler, H. Kohlstedt, Ch. Wenger (invited)

High-k Workshop 2019, Dresden, June 11 - 12, 2019, Germany
Towards Neuromorphic Computing: Inherent Stochastic Learning in Memristive HfO2 Arrays
Ch. Wenger (invited)

8th Mediterranean Conference on Embedded Computing (MECO 2019), Budva, June 10 - 14, 2019, Montenegro
Resilience more than the Sum of Security and Dependability: Cognition is what makes the Difference
Z. Dyka, E. Vogel, I. Kabin, M. Aftowicz, D. Klann, P. Langendörfer

IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2019), Boston, June 02 - 07, 2019, USA
IHP Highly-Miniaturized Multi-Channel Radar Sensors with Integrated On-Chip Antennas
H.J. Ng (invited)

IEEE MTT-S International Microwave Symposium (IMS 2019), Boston, June 02 - 07, 2019, USA
Recent Developments on SiGe BiCMOS Technologies for mm-wave and THz Applications
M. Wietstruck, St. Marschmeyer, S. Schulze, S. Tolunay Wipf, Ch. Wipf, M. Kaynak

2nd Joint Conference International SiGe Technology and Device Meeting and International Conference on Silicon Epitaxy and Heterostructures (ISTDM/ICSI 2019), Wisconsin-Madison, June 02 - 06, 2019, USA
Process Effects on the Noise Performance of SiGe/Si Multi Quantum Well Thermistor
C. Baristiran Kaynak, Y. Yamamoto, A. Goeritz, F. Korndoerfer, M. Stocchi, M. Wietstruck, Y. Gurbuz, M. Kaynak

2nd Joint Conference International SiGe Technology and Device Meeting and International Conference on Silicon Epitaxy and Heterostructures (ISTDM/ICSI 2019), Madison, June 02 - 06, 2019, USA
Modeling the Dynamics of Cross-Hatch Evolution in Heteroepitaxy
F. Rovaris, M.H. Zoellner, P. Zaumseil, A. Marzegalli, L. Di Gaspare, M. De Seta, T. Schroeder, P. Storck, G. Schwalb, G. Capellini, F. Montalenti

2nd Joint Conference International SiGe Technology and Device Meeting and International Conference on Silicon Epitaxy and Heterostructures (ISTDM/ICSI 2019), Madison, June 02 - 06, 2019, USA
Temperature-Dependent Strain-Shift Coefficient in Ge
C.L. Manganelli, M. Virgilio, O. Skibitzki, M. Salvalaglio, P. Zaumseil, Y. Yamamoto, M. Montanari, W.M. Klesse, G. Capellini

2nd Joint Conference International SiGe Technology and Device Meeting and International Conference on Silicon Epitaxy and Heterostructures (ISTDM/ICSI 2019), Madison, June 02 - 06, 2019, USA
N-Type Ge/SiGe Multi Quantum-Wells for a THz Quantum Cascade Laser
M. De Seta, C. Ciano, L. Di Gaspare, M. Montanari, L. Persichetti, M. Virgilio, L. Baldassarre, M. Ortolani, G. Capellini, O. Skibitzki, M.H. Zoellner, J. Faist, G. Scalari, D. Stark, D.J. Paul, K. Rew, O. Moutanabbir, S. Mukherjee, T. Grange, S. Birner

2nd Joint Conference International SiGe Technology and Device Meeting and International Conference on Silicon Epitaxy and Heterostructures (ISTDM/ICSI 2019), Wisconsin, June 02 - 06, 2019, USA
Group IV Heteroepitaxy for Advanced Electronic Devices Integrated in BiCMOS Technology
Y. Yamamoto, H. Rücker, B. Heinemann, St. Lischke, C. Baristiran Kaynak, M. Kaynak, B. Tillack (invited)

IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2019), Boston, June 02 - 04, 2019, USA
A 26-GHz Vector Modulator in 130-nm SiGe BiCMOS Achieving Monotonic 10-b Phase Resolution Without Calibration
I. Kalyoncu, A. Burak, M. Kaynak, Y. Gurbuz

69th IEEE Electronic Components and Technology Conference (ECTC 2019), Las Vegas, May 28 - 31, 2019, USA
Al-Al Direct Bonding with Sub-µm Alignment Accuracy for Millimeter Wave SiGe BiCMOS Wafer Level Packaging and Heterogeneous Integration
M. Wietstruck, S. Schulze, B. Rebhan, P. Kerepesi, H. Kurz, G. Silberer, J. Meiler, S. Tolunay Wipf, Ch. Wipf, M. Kaynak

IEEE 69th Electronic Components and Technology Conference (ECTC 2019), Las Vegas, May 28 - 31, 2019, USA
Development of a Wafer Level Al-Al Thermo-Compression Bonding
S. Schulze, M. Wietstruck, M. Fraschke, P. Kerepesi, H. Kurz, B. Rebhan M. Kaynak

24th IEEE European Test Symposium (ETS 2019), Baden-Baden, May 27 - 31, 2019, Germany
Self-Adaptive Cross-Layer Fault Tolerance in Multiprocessor Systems
J.-C. Chen, M. Krstic

European Test Symposium PhD Forum (ETS 2019), Baden-Baden, May 27 - 31, 2019, Germany
A Methodology for Characterization and Mitigation of SET Effects in Combinational Logic
M. Andjelkovic, M. Krstic, R. Kraemer

24th IEEE European Test Symposium Ph.D. Forum (ETS 2019), Baden-Baden, May 27 - 31, 2019, Germany
Programmable In-Situ Delay Monitor for Energy-Efficient and Resilient Complex SoC
M. Veleski, R. Kraemer, M. Krstic

4th International Conference on Terahertz Emission, Metamaterials and Nanophotonics (TERAMETANANO 2019), Lecce, May 27 - 31, 2019, Italy
N-Tpe Ge/SiGe Multi Quantum-Wells for a THz Quantum Cascade Laser
M. Montanari, L. Persichetti, C. Ciano, M. Virgilio, L. Di Gaspare, M. Ortolani, L. Baldassarre, M.H. Zoellner, O. Skibitzki, D. Stark, G. Scalari, J. Faist, K. Rew, D.J. Paul, M. Scuderi, G. Nicotra, S. Mukherjee, O. Moutanabbir, T. Grange, S. Birner, G. Capellini, M. De Seta

8th International Conference on Spectroscopic Ellipsometry (ICSE 2019), Barcelona, May 26 - 31, 2019, Spain
Diagnostic of Graphene on 200 mm Ge(100)/Si(100) Wafers by Spectroscopic Ellipsometry
O. Fursenko, M. Lukosius, J. Bauer, C. Villringer, M. Fraschke, M. Lisker, A. Mai

FPGA Kongress 2019, München, May 21 - 23, 2019, Germany
Implementierung einer generischen SDR-Plattform auf Basis des Zynq Ultrascale+ RFSoC
M. Petri, M. Appel

42nd International Spring Seminar on Electronics Technology (ISSE 2019), Wroclaw, May 15 - 19, 2019, Poland
Silicon Systems for Wireless Communications - Design, Modeling, Verification, Implementation, Integration, and Test
Z. Stamenkovic (invited)

European Microwave Conference in Central Europe (EuMCE 2019), Prague, May 13 - 15, 2019, Czech Republic
Mechanical and Thermal Modeling of an Uncooled Microbolometer
C. Baristiran Kaynak, A. Göritz, Y. Yamamoto, M. Wietstruck, M. Stocchi, K.E. Unal, M.B. Ozdemir, Y. Ozsoy, Y. Gurbuz, M. Kaynak

11th Wireless Days Conference (WD 2019), Manchester, April 24 - 26, 2019, UK
A SoC-based SDR Platform for Ultra-High Data Rate Broadband Communication, Radar and Localization Systems
M. Petri, M. Ehrig

22nd International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2019), Cluj-Napoca, April 24 - 26, 2019, Romania
Modular Data Link Layer Processing for THz Communication
L. Lopacinski, M.H. Eissa, G. Panic, A. Hasani,, R. Kraemer

IEEE International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS 2019), Mykonos, April 16 - 18, 2019, Greece
Horizontal DPA Attacks against ECC: Impact of Implemented Field Multiplication Formula
I. Kabin, Z. Dyka, D. Klann, P. Langendörfer

Single-Molecule Sensors and Nanosystems International Conference (S3IC 2019), München, April 03 - 05, 2019, Germany
Immobilization of single Biomolecules on Nano-Electrode Arrays by Dielectrophoresis
X. Knigge, Ch. Wenger, F.F. Bier, R. Hölzel

Single-Molecule Sensors and Nanosystems International Conference (S3IC 2019), München, April 03 - 05, 2019, Germany
Production and Characterisation of Enzyme Nanoarrays Assisted by Alternating Fields
M. Noffke, X. Knigge, Ch. Wenger, F.F. Bier, R. Hölzel

Single-Molecule Sensors and Nanosystems International Conference (S3IC 2019), München, April 03 - 05, 2019, Germany
AC Electrokinetic Immobilisation of Nanoparticles and Proteins
R. Hölzel, X. Knigge, E.-M. Laux, M. Noffke, S. Stanke, Ch. Wenger, F.F. Bier

GMM-Nutzergruppentreffen Heißprozesse und RTP & Nutzergruppentreffen der GMM-Fachgruppe Ionenimplantation, Erlangen, April 03 - 04, 2019, Germany
Millisecond Flash Lamp Annealing and Application for SiGe-HBT
A. Scheit, T. Lenke, T. Schumann, L. Rebohle, W. Skorupa, S. Häberlein (invited)

GMM-Nutzergruppentreffen Heißprozesse und RTP & Nutzergruppentreffen der GMM-Fachgruppe Ionenimplantation, Erlangen, April 03 - 04, 2019, Germany
Morphology Adjustment for Selective Silicon Chemical Vapor Deposition
A. Scheit, Y. Yamamoto, St. Marschmeyer, R. Sorge (invited)

French-German THz conference 2019, Kaiserslautern, April 02 - 05, 2019, Germany
N-Type Ge/SiGe Quantum Cascade Devices for THz Electroluminescence
D. Stark, L. Perischetti, M. Montanari, C. Ciano, L. Di Gaspare, M. De Seta, M. Zoellner, O. Skibitzki, G. Capellini,, M. Ortolani, L. Baldassarre, M. Virgilio, T. Grange, S. Birner, K. Rew, D.J. Paul, J. Faist, G. Scalari

Frühjahrstagung der Deutschen Physikalischen Gesellschaft (DPG 2019), Regensburg, April 01 - 05, 2019, Germany
Electronic Noise in Hafnium and Yttrium Oxide-Based RRAM Devices
M. Lonsky, E. Piros, S. Petzold, E. Jalaguier, E. Nolot, C. Charpin, Ch. Wenger, L. Alff, J. Müller

Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS 2019), Grenoble, April 01 - 03, 2019, France
Effective Reduction of the Programing Pulse Width in Al:HfO2-based RRAM Arrays
O. Gonzalez Osorio, E. Perez, Ch. Wenger, S. Dueñas, H. Castan, H. Garcia

13th European Conference on Antennas and Propagation (EuCAP 2019), Krakow, March 31 - April 05, 2019, Poland
Highly Integrated Dual-Band Dual-Polarized Antenna Tile for SAR Applications
E. Arnieri, L. Boccia, G. Amendola, S. Glisic, C. Mao, S. Gao, T. Rommel, P. Penkala, M. Krstic, U. Yodprasit, A. Ho, O. Schrape, M. Younis

IEEE International Reliability Physics Symposium (IRPS 2019), Monterey, March 31 - April 04, 2019, USA
Reliability of CMOS Integrated Memristive HfO2 Arrays with Respect to Neuromorphic Computing
M.K. Mahadevaiah, E. Perez, Ch. Wenger, F. Zahari, H. Kohlstedt, A. Grossi, C. Zambelli, P. Olivo, M. Ziegler

International Reliability Physics Symposium (IRPS 2019), Monterey, March 31 - April 04, 2019, USA
Reliability of CMOS Integrated Memristive HfO2 Arrays with Respect to Neuromorphic Computing
Ch. Wenger, F. Zahari, M.K. Mahadevaiah, E. Perez, A. Grossi, C. Zambelli, P. Olivo, H. Kohlstedt, M. Ziegler

DPG-Frühjahrstagung 2019, Regensburg, March 31 - April 04, 2019, Germany
Electronic Transport in Gold-Contacted Graphene on Germanium
S. Bode, A. Sinterhauf, M. Auge, M. Lukosius, G. Lippert, Ch. Wenger H.Ch. Hofsäss, M. Wenderoth

Graph Korea 2019, Seoul, March 26 - 29, 2019, South Korea
Towards the Integration of 200 mm Graphene into Microlelectronics
M. Lukosius, M. Lisker, G. Dziallas, J. Dabrowski, M. Fraschke, G. Lippert, C. Alvarado, A. Mai, Ch. Wenger (invited)

12th German Microwave Conference (GeMIC 2019), Stuttgart, March 25 - 27, 2019, Germany
An Integrated VCO With Frequency Tripler in SiGe BiCMOS with a 1-dB Bandwidth from 22GHz to 32GHz for Multiband 5G Wireless Networks
F. Herzel, G. Panic, J. Borngräber, D. Kissinger

Leibniz-Konvent "Künstliche Intelligenz" 2019, Berlin, March 22, 2019, Germany
Ansätze zur Hardware-Implementierung von KI
Ch. Wenger (invited)

EFDS Workshop and Tutorial "ALD for Industry" 2019, Berlin, March 19 - 20, 2019, Germany
Memristive ALD Films for Neuromorphic Networks
Ch. Wenger (invited)

IEEE International Conference on Microelectronic Test Structures (ICMTS), Fukuoka, March 18 - 21, 2019, Japan
Physical, Small-Signal and Pulsed Thermal Impedance Characterization of Multi-Fingers SiGe HBTs Close to the SOA Edges
M. Couret, G.G. Fischer, S. Fregonese, T. Zimmer, C. Maneux

83. Jahrestagung der DPG und DPG-Frühjahrstagung der Sektion Atome, Moleküle, Quantenoptik und Plasmen (SAMOP), Rostock, March 10 - 15, 2019, Germany
Comparison of Different Silicon Nitride Materials for Technological Fabrication of Photonic Components
O. Kurzel, H.H. Richter, M. Fraschke, M. Lisker, T. Grabolla, L. Zimmermann, A. Mai

Optical Fiber Communications Conference and Exposition (OFC 2019), San Diego, California, March 03 - 07, 2019, USA
64-GBd DP-Bipolar-8ASK Transmission over 120 km SSMF Employing a Monolithically Integrated Driver and MZM in 0.25-µm SiGe BiCMOS Technology
G.R. Mehrpoor, C. Schmidt-Langhorst, B. Wohlfeil, R. Elschner, D. Rafique, R. Emmerich, A. Dochhan, I. Lopez, P. Rito, D. Petousi, D. Kissinger, L. Zimmermann, C. Schubert, B. Schmauss, M. Eiselt, J.-P. Elbers

8th International Conference on Sensor Networks (SENSORNETS 2019), Prague, February 26 - 27, 2019, Czech Republic
The Impact of Diverse Execution Strategies on Incremental Code Updates for Wireless Sensor Networks
K. Lehniger, S. Weidling

ITG/GI/GMM-Workshop Testmethoden und Zuverlässigkeit von Schaltungen und Systemen (TuZ 2019), Prien am Chiemsee, February 24 - 26, 2019, Germany
SPICE-based SET Pulse Width Model
M. Andjelkovic, M. Krstic, R. Kraemer

GraphIn 2019, Madrid, February 21 - 22, 2019, Spain
Integration of Graphene into 200 mm CMOS Technology
M. Lukosius, M. Lisker, J. Dabrowski, G. Dziallas, M. Fraschke, A. Krüger, F. Akhtar, Y. Yamamoto, O. Fursenko, D. Wolansky, A. Schubert, G. Lippert, A. Mai, Ch.Wenger (invited)

1. digilog-Kongress 2019, Berlin, February 21, 2019, Germany
Mobile Ultraschalldiagnostik (POCUS) und Sono-Teleconsulting
D. Nürnberg, S. Hoffmann, St. Ortmann, A. Haddadi Esfahani, Ch. Wenger, V. Frauendorf, H. Lo

22nd Conference on Innovation in Clouds, Internet and Networks (ICIN 2019), Paris, February 19 - 21, 2019, France
Next-Cell Prediction Based on User’s Long-Term Cell Sequence History and Current-Cell Trajectory
M. Goodarzi, V. Sark, N. Maletic, J. Gutierrez Teran, E. Grass

2nd European Biosensoor Symposium (EBS 2019), Florence, February 18 - 21, 2019, Italy
Production and Characterization of Enzyme Nanoarrays Assisted by Alternating Electric Fields
M. Noffke, X. Knigge,Ch. Wenger,, F.F. Bier, R. Hölzel

2nd European Biosensoor Symposium (EBS 2019), Florence, February 18 - 21, 2019, Italy
AC Electrokinetic Immobilisation of Nanoparticles and Proteins
R. Hölzel, X. Knigge, E.-M. Laux, M. Noffke, S. Stanke, Ch. Wenger, F.F. Bier

2nd European Biosensoor Symposium 2019, Florence, February 18 - 21, 2019, Italy
Dielectrophoretic Immobilization of single Biomolecules
X. Knigge, Ch. Wenger, F.F. Bier, R. Hölzel

International Solid States Circuits Conference (ISSCC 2019), San Francisco, February 17 - 21, 2019, USA
A 13.5dBm Fully Integrated 200-255 GHz Power Amplifier with a 4-Way Power Combiner in SiGe:C BiCMOS
M.H. Eissa, D. Kissinger

12th International Conference on Systems, Communications and Coding (SCC 2019), Rostock, February 11 - 14, 2019, Germany
Secret Key Generation Based on Channel State Information in a mmWave Communication System
N. Felkaroski, M. Petri

SPIE Photonics West OPTO (2019), San Francisco, February 05 - 07, 2019, USA
Endoscopic Orientation by Multimodal Data Fusion
S. Pulwer, R. Fiebelkorn, Ch. Zesch,, P. Steglich, C. Villringer, F. Villasmunta, E. Gedat, J. Handrich, S. Schrader, R. Vandenhouten

SPIE Photonics West 2019, San Francisco, February 02 - 07, 2019, USA
Fabry-Pérot Polymer Film Sensors with Spatially Homogeneous Resonance Frequency for Camera-Based Photoacoustic Signal Acquisition
C. Villringer, T.S. Gilani, P. Steglich, S. Pulwer, M. Richetta, S. Schrader, J. Laufer

SPIE Photonics West LASER 2019, San Francisco, February 02 - 07, 2019, USA
Raman Lasers for Trace Gas Detection
C. Zesch, S. Pulwer,, P. Steglich,, P. Prosposito, S. Schrader, H. J. Eichler

1and2DM 2019, Tokyo, January 29 - 31, 2019, Japan
Graphene Synthesis on 200mm Wafers
M. Lukosius, M. Lisker, J. Dabrowski, F. Akhtar, Y.Yamamoto, C. Alvarado, A. Becker G. Lippert, A. Mai Ch. Wenger (invited)

IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus 2019), Saint Petersburg, Moscow, January 28 - 30, 2019, Russia
Automated Extraction of Silicon Dioxide Thermal Conductivity Values Based on Electro-Thermal Simulations
A. Datsuk, F. Korndörfer, M. Kaynak, Z. Cao, K. Dhawan, V. Timoshenkov

IHT-Institutskolloquium "Bauelemente und Technologien", Stuttgart, January 23, 2019, Germany
Optoelectronics based on GeSn Nanostructures
V. Schlykow, N. Taoka, G. Niu, P. Zaumseil, O. Skibitzki, W.M. Klesse, M.A. Schubert Y. Yamamoto, I.A. Fischer, B. Witzigmann, G. Capellini, T. Schroeder (invited)

IEEE Radio and Wireless Symposium (RWS 2019), Orlando, Florida, January 20 - 23, 2019, USA
A 60 GHz Ring Sensor with Differential Feed-lines for Dielectric Spectroscopy in Biomedical Applications
R.K. Yadav, J. Wessel, D. Kissinger

IEEE Radio and Wireless Week (RWW 2019), Orlando, January 20 - 23, 2019, USA
Design of Planar Waveguide Transition and Antenna Array utilizing Low-Loss Substrate for 79 GHz Radar Applications
W. Ahmad, H.J. Ng, D. Kissinger

20th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2019), Orlando, Florida, January 20 - 23, 2019, USA
Finite-Element Modelling of Stress Induced Wafer Warpage for a Full BiCMOS Process
Z. Cao, A. Göritz, S. Tolunay Wipf, A. Trusch, M. Kaynak

20th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2019), Orlando, Florida, January 20 - 23, 2019, USA
Development and Mechanical Modeling of Si1-xGex/Si MQW Based Uncooled Microbolometers in a 130 nm BiCMOS
C. Baristiran Kaynak, A. Göritz, Y. Yamamoto, M. Wietstruck, M. Stocchi, K.E. Unal, M.B. Ozdemir, Y. Ozsoy, Y. Gurbuz, M. Kaynak (invited)

IEEE Radio and Wireless Week (RWW 2019), Orlando, Florida, January 20 - 23, 2019, USA
Low Insertion Loss D-Band SPDT Switches Using Reverse and Forward Saturated SiGe HBTs
A. Karakuzulu, A. Malignaggi, D. Kissinger

20th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2019), Orlando, Florida, January 20 - 23, 2019, USA
RF-MEMS Based V-Band Impedance Tuner Driven by Integrated High-Voltage LDMOS Switch Matrix and Charge Pump
Ch. Wipf, R. Sorge, S. Tolunay Wipf, A. Göritz, A. Scheit, D. Kissinger, M. Kaynak

IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2019), Orlando, Florida, January 20 - 23, 2019, USA
A Low-Power D-type Flip-flop with Active Inductor and Forward Body Biasing Techniques in 40 nm CMOS
Y. Liang, C. Chye Boon, D. Kissinger, Y. Wang

IEEE Computing and Communication Workshop and Conference (IEEE CCWC 2019), University of Nevada, Las Vegas, USA, January 07 - 09, 2019, USA
Noise Performance of Orthogonal RF Beamforming for THz Radio Communications
K.K. Tiwari, E. Grass, R. Kraemer

Das Gebäude und die Infrastruktur des IHP wurden finanziert vom Europäischen Fonds für regionale Entwicklung, von der Bundesregierung und vom Land Brandenburg.