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High-speed connectivity everywhere: IHP coordinates project on large scale test of 5G mobile networks

In 2020, the commercial roll out of this new technology will start

Joint project of German and Japanese researchers started at IHP

Scientists of Tohoku University and IHP exchanged on epitaxy processes for advanced electronic devices

Für ein Zusammenleben in Vielfalt

IHP engagiert sich im Bündnis der Vielfaltsgestalter

Wer sind die Besten im Land Brandenburg?

Siegerehrung der 29. Landesolympiade Physik im IHP

IHP presents a new wafer bonding technology for advanced wafer-level packaging at ECTC 2019 in Las Vegas

Low-temperature covalent wafer bonding technologies for developing next-generation communication devices have been successfully processed in cooperation with EV Group (EVG)

IHP’s essential participation in developing high performance 5G wireless technologies

Third Horizon 2020 EU-project within the 5G-framework coordinated by IHP

This year IHP organises two international summer schools on current microelectronic topics

Young researchers are requested to apply now for the events in June respectively in August

IHP hosted German Japanese Workshop

Scientists of Hiroshima University and IHP talked about THz Technologies and Circuits

Grenzüberschreitendes Projekt des IHP erhält Zuschlag

IHP und Universität Zielona Gora entwickeln im Projekt Smart River Grundlagen für eine intelligente Doppelstadt Frankfurt (Oder)/Slubice

EU project CALADAN set to reduce manufacturing cost of Terabit/s capable optical transceivers

IHP – Innovations for High Performance Microelectronics is one of three leading European research institutes within the project

The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.