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SPEED

Silicon Photonics Enabling Exascale Data Networks

Objective

SPEED creates a platform for development, manufacturing and packaging of application-specific electro-photonic integrated circuits (ePICs) in Silicon. ePICs combine electronic and optical functions on a single semiconductor chip, delivering better performance, smaller footprint and lower cost than competing solutions. Target applications are board-mount optical transceivers for ultra-high-speed data center interconnects. Using a common framework, the project will develop two next-generation 400Gbit/s board-mount optical transceivers: a four wavelength direct-detect solution for intra-data center and a single-wavelength tunable coherent device for inter-data center interconnects. The innovative approach that the SPEED consortium is pursuing will help the industry tackle critical issues concerning cost efficiency, power consumption and thermal management.

IHP`s Contribution

IHP develops the world’s first photonics enabled high-performance BiCMOS technology and provides this technology in early access to SPEED partners. Photonic BiCMOS is the baseline technology for all applications targeted in SPEED. Within SPEED, IHP will setup an industry compatible framework for an ASIC-like development of integrated photonic-electronic solutions covering all necessary aspects from multi-project wafer fabrication, process design-kit, and opto-electronic waferscale testing.

Funding

This research is funded by the Bundesministerium für Forschung und Bildung (BMBF.)

Project Partners

ADVA Optical Networking

AEMtec

FhG IZM

FhG HHI

Finetech

Ranovus GmbH

Sicoya GmbH

The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.