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Modular CMOS Photonic Integrated Micro-Gyroscope


Space system vendors seek for solutions to deliver small size and cost-effective sensor systems to “de-congest” satellite payloads, drastically reduce the equipment cost and open the possibility for new generation of micro-payload systems.

MERMIG invests in the right mix of silicon photonic CMOS-compatible component fabrication and nano-imprint lithography laser fabrication for developing low-cost, compact, and power-efficient gyroscopes responding to the need for robust intertial measurement units (IMUs). Both technologies are being adopted by the terrestrial telecom market and MERMIG will develop them for bringing their unique advantages into space sensor systems.

IHP's Contribution

IHP provides state-of-the-art silicon photonics technology to implement novel and highly compact single-chip optical gyroscope sensor. Silicon photonic technology will squeeze the gyroscope functionality into a few cm2, integrating racetrack cavities, PIN junctions and a phase decoder into compact sub-micron waveguides.


This project has received co-funding from the European Commission, project no. FP7-SPACE-2012-1-313037.

Project Partners

  • DAS Photonics S.L., Spain
  • Astrium S.A.S., France
  • Constelex Technology Enablers LLC (part of Gooch & Housego), UK
  • Modulight O.Y., Finland
  • Universitat Politecnica De Valencia - Nanophotonics Technology Centre, Spain
  • Politecnico Di Bari, Italy
The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.