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HELIOS

Photonics Electronics functional Integration on CMOS

Objective

Photonics on CMOS is a candidate technology for applications where functional integration is needed for improving system performance while reducing size and cost. Functional demonstration of basic building blocks such as a µlaser, a detector, coupling, and link has been realized in previous research projects. As a next step the HELIOS project proposes to integrate photonics components with integrated circuits as a joint effort of major players of the European CMOS Photonics community, in order to enable an integrated design and fabrication chain that can be transferred to EU manufacturers. The objective of the project HELIOS is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics fabrication processes.

IHP's Contribution

Build and characterize a demonstrator for a discrete Si modulator at 10 Gbps and 40 Gbps integrated with SiGe CMOS technology.

Funding

This project has received funding from the European Union.

The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.