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PHOIBOS

Photonische Wirebonds für optische Multi-Chip-Systeme

Objective

PHOIBOS studies and develops a novel opto-electronic assembly technology, so called photonic wirebonds, which will allow for implementation of a novel generation of highly integrated optoelectronic systems. Such systems are key to overcome transmission bottlenecks in large-scale data centers, optical access networks, and high-performance computing. Photonic wire bonds connect integrated photonic circuits across chip boundaries. The concept exploits direct-write multi-photon lithography for in-situ fabrication of three-dimensional freeform waveguides.

IHP's Contribution

IHP develops silicon photonic building blocks and the optical interface to photonic wirebonds in IHP’s photonic integrated circuit technology. Best coupling to photonic wirebonds is achieved by un-cladded inverse taper structures, which requires dedicated process development for the interface.

Funding

This project has received co-funding from the German ministry of research and education (BMBF), project no. 13N12578.

Project Partners

  • Karlsruhe Institute of Technology / Institute of Photonics & Quantum Electronics (IPQ)
  • Carl Zeiss AG
  • Nanoscribe GmbH
  • Fraunhofer Heinrich-Hertz Institut (HHI)
  • FCI Deutschland GmbH
  • Alcatel-Lucent Deutschland    
  • IBM Research (Switzerland)
The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.