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VHiSSi

Very High Speed Data Interfaces

Objective

  • Provide multi-Gbit/s serial data-link technology, essential for future spacecraft onboard data-handling systems.
  • Provide a complete solution for spacecraft onboard data-links and networks.
  • Use a European semiconductor fabrication facility and provide corresponding radiation tolerant library.

IHP`s Contribution

  • Defining implementation specs
  • Supporting chip design and library generation
  • Chip fabrication in IHP 0.13 um technology
  • Functional verification of the chip

Funding

EU FP7 Call: Critical Space Technologies: Very High Speed Serial Interfaces
(SPA.2011.2.2-02)

Project Partners

  • University of Dundee (UK) / coordinator
  • STAR-Dundee Ltd (UK)
  • ACE-IC Ltd (ISR)
  • Ramon Chips Ltd (ISR)
  • EADS Astrium GmbH (D)
  • Euro Instruments Trading s.r.l. (IT)
The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.