Modular Processor Library
MPL
Objective
The project is used internally to develop a library of verified and re-usable modules based on the IHP BiCMOS (SiGe:C) technology. The focus are low-power processors and multi-processor solutions for high performance wireless communication systems. Further emphasis is placed on radiation-hard components for applications in space.
Additional design support is given to customers in developing reliable systems in short time.
Motivation
The MPL project will enable powerful and competitive system-on-chip solutions which can be implemented very flexible and very fast according to actual market requirements.
Project Partners
German Aerospace Center (radiation-hard processor)
Aeroflex Gaisler AB (Leon processor cores and components)
Genesys Ltd., Ukraine (memory generators)
Humboldt University of Berlin (PCB designs)
IHP GmbH (chip production and measurement)
Cadence Design Systems Inc. (simulation, layout design)
Mentor Graphics Inc. (simulation, layout design)
Perforce Software Inc. (version control management)
Synopsys Inc. (net list synthesis)