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SECHIS

SERDES Chip for Space Applications

Objective

The main goal of the SECHIS project is to investigate the architectures for high speed serial interfaces using European microelectronics technologies and the implementation of a radiation hardened SERDES chip for use in space environment. The main project result will be a SERDES (Serializer/Deserializer) chip with a throughput over 2Gbps, implemented on IHP’s cutting edge technologies and ready for qualification.

IHP`s Contribution

Design, implementation and validation of the SERDES prototyp and final IC

Funding

The project is Co-funded by EUREKA member countries and the European Union Horizon 2020 Framework Programme.

Project Partners

  • Arquimea Ingenieria S.l.u.
  • IHP GmbH
  • Arquimea Deutschland GmbH
The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.