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Technology Solutions


Create your specific solutions with IHP's technologies!

IHP is a unique supplier for silicon based  technology developments and solutions.


We offer: 

CMOS/BiCMOS device and module solutions

  • SiGe HBT devices & modules

o    SiGe-npn beyond 500 GHz fmax

o    SiGe pnp HBT modules and complementary BiCMOS technologies

  • Multi-Project Wafer & Prototyping Service for

o    BiCMOS baseline technology solutions at 0.25 and 0.13 µm technologies (JEDEC qualified)

o    SiGe-BiCMOS & Module developments (Through silicon Via, Local Backside/Deep Silicon etch)

o    Smart Power devices & modules (e.g. LDMOS)

o    SiGe-BiCMOS-InP-HBT technology platform


More information:

Department Head
Department Head

Prof. Andreas Mai



Im Technologiepark 25

15236 Frankfurt (Oder)





Monika Schultze

Phone: +49 335 5625 660

Fax: +49 335 5625 327

Silicon Photonics device and module solutions

  • Photonic Integrated Circuit (PIC) technologies
  • High performance photonic devices (e.g. Ge-PIN detectors, Modulators)
  • Electronic-Photonic-Integrated-Circuit Technology  (EPIC-Photonic-BiCMOS) 


More information:

MEMS device and module solutions

  • Hermetically packaged RF-MEMS switches beyond 100 GHz with IL<1 dB, ISO>30 dB
  • RF-MEMS varactors with very high linearity and power handling 


More information:

Wafer bonding and thin wafer handling solutions

  • Temporary and permanent wafer bonding
  • Ultra-thin silicon wafer handling

Left: BiCMOS embedded RF-MEMS switch

Right: SiGe BiCMOS chip with integrated  TSV (chip thickness 80µm)



The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.