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IHP

Technology Solutions

IHP offers diverse technological solutions such as Multi Project Wafer & Prototyping Service with 0.25 μm / 0.13 μm SiGe BiCMOS including HBTs up to 500 GHz, RF LDMOS up to 50 GHz and RF MEMS up to 140 GHz as well as Silicon Photonics.

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Services

MPW & Prototyping

IHP offers research partners and customers access to its powerful technologies.

 
IHP Solutions GmbH, corporation for technology-based innovation transfer

Jobs

Service Engineer (m/f/d) Clean Room (Shift Operation)

Summer School

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About us

Get a quick overview of IHP's current research and development activities

 

Research

Our Departments Materials Research Materials Research Materials Research Materials Research

Our four Research Programs:

Wireless Systems and Applications

Wireless Systems and Applications

 
RF Circuits

RF Circuits

 
Technology Platform for Wireless and Broadband

Technology Platform for Wireless and Broadband

 
Materials for Micro- and Nanoelectronics

Materials for Micro- and Nanoelectronics

 
 

News

12.06.2019

"Wer sind die Besten im Land Brandenburg?"

Siegerehrung der 29. Landesolympiade Physik im IHP

29.05.2019

"IHP presents a new wafer bonding technology for advanced wafer-level packaging at ECTC 2019 in Las Vegas"

Low-temperature covalent wafer bonding technologies for developing next-generation communication...

Tag der offenen Tür 07.09.2019

How to find us

 

IHP
Im Technologiepark 25
15236 Frankfurt (Oder)
Germany
Phone: +49 335 5625 0

Fraunhofer Group for Microelectronics in cooperation with the Leibniz institutes IHP and FBH

FMD Innovation Days 12./13.09.2019

 
The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.