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application/pdfIEEEIEEE Transactions on Components, Packaging and Manufacturing Technology;2022;12;6;10.1109/TCPMT.2022.3172502Monolithic Integration of a Wafer-Level Thin-Film Encapsulated mm-Wave RF-MEMS Switch in BEOL of a 130-nm SiGe BiCMOS TechnologyBipolar CMOS (BiCMOS)millimeter-wave (mm-wave)packagingRF-microelectro-mechanical-system (MEMS) switchwafer-level thin-film encapsulation (WLE)Alexander GoritzSelin Tolunay WipfMartin DrostMarco LiskerChristian WipfMatthias WietstruckMehmet Kaynak
IEEE Transactions on Components, Packaging and Manufacturing Technology921 June 2022610.1109/TCPMT.2022.317250212932
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