[44]

A Narrow Bandwidth Microstrip Bandpass Filter Suitable for System-on-Package Integration

A. Cagri Ulusoy, Gang Liu, Till Feger, Andreas Trasser, and Hermann Schumacher

This paper will be presented at the coming Mediterranean Microwave Symposium (August 25-27, MMS2010, http://www.mms.ncc.metu.edu.tr ).

Abstract: In this paper we present a compact microstrip bandpass filter using transmission zeros for narrowband characteristics, to be used in the carrier recovery path of a GB/s QPSK receiver. Several filters are designed operating at 20 GHz with relative bandwidths (RBW) varying from 1.75% to 10%, and insertion losses varying from 3.5 dB to 0.8 dB. A prototype filter is realized and good agreement between the measurement and simulation results is achieved. The applicability of the filter for system-on-package (SoP) integration is validated by a prototype wire bond connection to a thin film microstrip test structure on a Si substrate.

Deutsch		Home	Partners	Sub-Projects	Publications
Publications Publications, alphabetical order Publications 2008 Publications 2009 Publications 2010 Publications 2011 ICC 2009 PR 01/2009 Final Presentation	[44] A Narrow Bandwidth Microstrip Bandpass Filter Suitable for System-on-Package Integration A. Cagri Ulusoy, Gang Liu, Till Feger, Andreas Trasser, and Hermann Schumacher This paper will be presented at the coming Mediterranean Microwave Symposium (August 25-27, MMS2010, http://www.mms.ncc.metu.edu.tr ). Abstract: In this paper we present a compact microstrip bandpass filter using transmission zeros for narrowband characteristics, to be used in the carrier recovery path of a GB/s QPSK receiver. Several filters are designed operating at 20 GHz with relative bandwidths (RBW) varying from 1.75% to 10%, and insertion losses varying from 3.5 dB to 0.8 dB. A prototype filter is realized and good agreement between the measurement and simulation results is achieved. The applicability of the filter for system-on-package (SoP) integration is validated by a prototype wire bond connection to a thin film microstrip test structure on a Si substrate.