The Off-Line Characterization research group supports research activities at IHP by a broad portfolio of analytical tools and techniques.
Our analytical capabilities are employed in the following areas:
- visualization of surface and cross-section morphology of IC's
- contamination analysis of Si-Wafer (quantification and mapping)
- depth profile analysis of dopants (quantification and profile shape)
- thickness and stoichiometry measurements of thin films
- strain and crystallinity analysis of epitaxial layer
- surface analysis of organic contaminants
- failure analysis of IC's
- circuit modification
- physical- and chemical material analysis
- characterization and diagnostics
An accurate analytical characterization of the devices and integrated circuits designed and manufactured at IHP is a key factor for their high performance. We develop and adapt analytical characterization concepts suited for BiCMOS and photonic technologies. A comprehensive IC's characterization is achieved by depth profiling, high-resolution imaging and elemental mapping. Besides analytical characterization failure analysis plays an important role in our activity. It is accompanied in many cases by circuit modification which helps to eliminate iterative cycles of prototype testing and mask modification.