MPW Schedule 2022 & 2023 and Price Information 2021
General Technology Description
IHP offers standard 0.13 and 0.25 μm CMOS processes which provide NMOS, PMOS, isolated NMOS and passive components such as poly resistors and MIM capacitors. In addition to the standard CMOS processes different front-end-of-line options are offered. In 0.25 μm CMOS the standard backend offers 3 thin metal layers and two TopMetal layers (TopMetal1 - fourth 2 μm thick metal layer, TopMetal2 – fifth 3 μm thick metal layer). The backend for 0.13 μm process offers 5 thin and 2 thick metal layers (TM1: 2 μm TM2: 3 μm). Together with a high dielectric stack this enables increased performance of the passive RF components.
Technologies with an enhanced BEOL option with copper are offered.
Technologies for MPW & Prototyping
| SG13S | A high-performance 0.13 µm BiCMOS with npn-HBTs up to fT / fmax= 250/340 GHz, with 3.3 V I/O CMOS and 1.2 V logic CMOS. |
|---|---|
| SG13G2 | A 0.13 µm BiCMOS technology with much higher bipolar performance of fT/fmax = 350/450 GHz. |
| SG13SCu | FEOL process SG13S together with 8 layer Cu BEOL option from X-FAB containing 4 thin Cu layers, 2 thick 3 µm Cu layers, a thin Al layer with 2 fF/µm MIM capacitor and a 2.8 µm Al top layer. |
| SG13G2Cu | FEOL process SG13G2 together with 8 layer Cu BEOL option from X-FAB containing 4 thin Cu layers, 2 thick 3 µm Cu layers, a thin Al layer with 2 fF/µm MIM capacitor and a 2.8 µm Al top layer. |
| SG25H5_EPIC | A monolithic photonic BiCMOS technology combining 0.25 µm CMOS, high-performance npn HBTs (fT / fmax = 220/290 GHz), and full photonic device set for C/O-band. |
| SG25H3 | A 0.25 µm technology with a set of npn-HBTs ranging from a higher RF performance (fT/fmax= 110/180 GHz) to higher breakdown voltages up to 7 V. |
| SGB25V | A cost-effective technology with a set of npn-HBTs up to a breakdown voltage of 7 V. |
| SGB25RH | Is a special variant of SGB25V which includes radiation hard IP for space applications. It is not allowed to use Process Design Kit IP together with SGB25V technology. |
The backend offers 3 (SG13: 5) thin and 2 thick metal layers (TM1: 2 μm, TM2: 3 μm).
A cadence-based mixed signal design kit is available. For high frequency designs an analogue Design Kit in ADS can be used. IHP's reusable blocks and IPs for wireless and broadband are offered to support your designs.
The following Modules are available
| LBE | The Localized Backside Etching module is offered to remove silicon locally to improve passive properties (available in all technologies). |
|---|---|
| PIC | Includes additional photonic design layers along with BiCMOS BEOL layers on SOI wafers. |
| TSV | An additional option in SG13S and SG13G2 technology that provides RF grounding by vias through silicon to improve RF performance. |
| MEMRES | A fully CMOS integrated memristive module based on resistive TiN / HfO2-x / TiN switching devices in SG13S technology, along with a Process Design Kit including layout and VerilogA simulation model. |
2.1 MPW Price Information 2021
Non-Commercial Access
For European non-profit and educational institutions, special discounts are offered for research projects via EUROPRACTICE.
2.1.1 Prices for Technologies
| Process | Area Price / mm2 |
|---|---|
| SGB25V | € 2500 |
| SGB25RH | € 3050 |
| SG25H3 | € 3800 |
| SG25H5_EPIC | € 8000 |
| SG13S | € 6300 |
| SG13C | € 4500 |
| SG13G2 | € 7300 |
| SG13SCu | € 6100 |
| SG13G2Cu | € 7000 |
2.1.2 Prices for Modules
| Module (Process) | Price |
|---|---|
| LBE (all) | € 5000 per order and technology |
| BEOL (only) 0.13 µm (SG13) | € 1000 (per mm2) |
| SG25_PIC | € 3800 (per mm2) |
| TSV (S, G2) | € 7500 per order |
| MEMRES (SG13S) | € 2500 per Run + € 600 per mm2 |
2.2 MPW Schedule 2022
There is a minimum area requirement of only 0.8 mm2 for all runs with bold shipment times. For all technologies or modules marked in brackets, minimum area order is required. For details see chapter 2.4. TAPE IN time is given in a column “TAPE IN”, while the shipment time in the corresponding table cells.
2.2.1 Schedule for complete technologies
| TAPE IN | SGB25 | SG25 | SG13 | ||||||
|---|---|---|---|---|---|---|---|---|---|
| V / RH** | H3 | EPIC | S (C) | MEMRES | SCu | G2Cu | G2 | ||
| Nov 8, 21 | *** | *** | Jun 20 | ||||||
| Dec 13, 21 | May 16* | May 31 | May 20* | May 31 | May 22* | ||||
| Feb 21, 22 | Jul 7 | Jul 20 | |||||||
| Apr 4, 22 | Jul 18* | Jul 13 | Nov 17 | ||||||
| Jul 18, 22 | Nov 10* | Nov 24 | (Dec 13) | (Dec 19) | Nov 25 | ||||
| Aug 1, 22 | Nov 9 | Nov 14* | |||||||
| Sep 19, 22 | Feb 2 | Feb 2 | Feb 17 | Mar 7* | |||||
| Nov 7, 22 | *** | *** | Jun 19 | ||||||
| Dec 12, 22 | May 16* | May 30 | May 19* | May 12 | May 23* | ||||
* Runs with lower priority
** TAPE IN for digital blocks is 1 month before standard TAPE IN
*** TAPE IN available on special request
Local Backside Etching (LBE) is not offered for EPIC runs. For all the other runs LBE is available and shipment will be 21 days later than the standard shipment. TSV module is available for SG13S and SG13G2 technologies and it leads to a 49 days longer cycle time.
2.2.2 BEOL (only)/SG25_PIC runs
Aluminum Backend of Line Runs are offered in SG13 for testing of passive structures only. Produced
are Metal1 and all layers above. On request Local Backside Etching (LBE) is offered for SG13 BEOL run. SG25_PIC run is offered on photonic substrates and includes active and passive photonic devices.
| TAPE IN | SG13 | SIG_PIC | TSV |
|---|---|---|---|
| Mar 14, 22 | Jun 1 | Aug 23 | |
| Aug 15, 22 | Dec 19 |
There might be internal BEOL or SG25_PIC runs, without confirmed schedule. Feel free to ask our customer support for more details if you are interested in joining such runs.
2.3 MPW Schedule 2023
Changes are possible till December 1st 2022.
There is a minimum area requirement of only 0.8 mm2 for all runs with bold shipment times. For all technologies or modules marked in brackets, minimum area order is required. For details see chapter 2.4. TAPE IN time is given in a column “TAPE IN”, shipment time in corresponding table cells.
Schedule for complete technologies
| TAPE IN | SGB25 | SG25 | SG13 | |||||||
|---|---|---|---|---|---|---|---|---|---|---|
| V / RH** | H3 | EPIC | S (C) | MEMRES | SCu | G2Cu | G2 | G3Cu | ||
| Nov 7, 22 | *** | *** | Jun 19 | |||||||
| Dec 12, 22 | May 16* | May 30 | May 19* | May 12 | May 23* | |||||
| Feb 20, 23 | Jul 6 | Jul 21 | Jul 30 | |||||||
| Apr 3, 23 | Jul 17* | Jul 12 | Nov 16 | |||||||
| Jul 3, 23 | Oct 26* | Nov 9 | (Nov 28) | (Dec 4) | Nov 10 | |||||
| Aug 7, 23 | (Nov 15) | (Nov 20)* | ||||||||
| Sep 18, 23 | Feb 1 | Feb 1 | Feb 16 | Mar 5* | ||||||
| Nov 6, 23 | Jun 17 | |||||||||
| Dec 11, 23 | May 14* | May 28 | May 23* | May 23 | May 7 | Jun 6 | ||||
* Runs with lower priority
** TAPE IN for digital blocks is 1 month before standard TAPE IN
*** TAPE IN available on special request
Local Backside Etching (LBE) is not offered for EPIC runs. For all the other runs LBE is available and shipment will be 21 days later than the standard shipment. TSV module is available for SG13S and SG13G2 technologies and for runs with low priority, it leads to a 35 days longer cycle time.
2.4 Information on Minimum Area per MPW Run
There is a minimum area requirement of only 0.8 mm² for selected technologies or module in schedule tables in chapter 2.2 and 2.3. This is valid for all technologies or modules marked with bold shipment times. For all technologies or modules marked with grey italic shipment times in brackets, minimum area order as given in the following table is required. A registration 4 weeks before TAPE out, followed by the confirmation from the foundry, is necessary in this case. By default these additional runs are without priority. A combination of 0.25 μm based runs and 0.13 μm based runs is not possible.
| Process | Min Area [mm²] | Min Area1 for Discount |
|---|---|---|
| SG25H3 | 18 | 15 |
| SG25H5_EPIC | 10 | 10 |
| SGB25V | 25 | 17 |
| SGB25RH | 25 | - |
| SG13S | 10 | 7 |
| SG13C | - | - |
| SG13G2 | 10 | 10 |
| SG13SCu | 10 | 10 |
| SG13G2Cu | 10 | 10 |
| SG25_PIC | 12 | 12 |
1 Ask for special price if you need more than this area for one MPW run.
Delivery
As default 40 diced samples will be delivered. Exceptions are designs using TSV module and SG25_PIC. Here 25 samples will be delivered by default. The delivery includes E-test data and RF measurements.
Back lapping options:
- 200 µm (no additional fee)
- 300 µm (no additional fee)
- 250 µm (additional fee)
- 150 µm (additional fee)
- 100 µm (additional fee)
- 75 µm (for TSV module only)
Hot lots and additional dies are available upon request.
Research Engineering Runs
IHP is offering complete mask sets only for research purpose and prototyping. If customer specific modules are added to a qualified technology, this technology is considered as non-qualified with status “early access”. Prices for Research Engineering Runs can be given upon request.
IHP's General Terms and Conditions »
For further information please contact:
Dr. René Scholz
IHP GmbH
Im Technologiepark 25
15236 Frankfurt (Oder)
Germany
Phone: +49 335 5625 647
Fax: +49 335 5625 327
Send e-mail »
