APECS — European Pilot Line for Advanced Packaging and Heterogeneous Integration
APECS aims to accelerate the development and industrial deployment of advanced packaging and heterogeneous integration technologies for next-generation electronic systems. It is a distributed European pilot line providing industry, SMEs and research organizations with access to technologies, infrastructure and expertise for advanced packaging, chiplets and heterogeneous integration. It connects design, technology development, testing and pilot-scale manufacturing to support the transition from research results to industrial applications.
Within the frame of the project, system-in-package solutions including design, simulation, technology and applications for a wide range of applications will be developed by the different project partners including the FMD together with several European partners.
At IHP, the research groups Millimeter-Wave & THz Sensor Circuits (MMTS), Heterogeneous Integration of Devices and Technologies (HDT), and Research & Prototyping Service (RPS) are directly contributing to the implementation of the pilot line.
Key contributions from the MMTS research group are planned to demonstrate the heterogeneous integration platform through the design and development of sub-THz transceivers for advanced sensors, exploiting multi-material stack-ups with III-V devices and advanced packaging technologies.
Our RPS team contributes SiGe BiCMOS and interposer technologies together with design-enablement expertise. Within RPS, APECS strengthens Open PDK and ADK capabilities for interposer- and chiplet-based assemblies, including assembly-level design, modelling and verification, and connects these services with the wider European advanced-packaging infrastructure.
The HDT research group works specifically to develop advanced collective-die-to-wafer Al-to-Al bonding technologies for BiCMOS wafer-level packaging applications. In addition, several project demonstrators will be realized using IHPs SiGe BiCMOS together with III-V technologies enabling future heterogeneous system integration.
APECS is set to strengthen the technological sovereignty of advanced packaging in Europe. The project targets to strengthen the transfer of research results into industrial applications and expand European capabilities in advanced semiconductor packaging and heterogeneous integration.
Funding: APECS is funded by the Horizon Europe and Digital Europe Programs, as well as the national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, and Spain.
Project partners: https://www.apecs.eu/en/apecs-partners.html
More information: https://www.apecs.eu/
