System Integration and Test Services

The group System Integration and Test Services deals with topics in the areas of ASIC design, test methods on chip and wafer, chip integration in package or on PCB, and demonstrator integration. This group is focused on providing the services to internal or external customers or working on the applied industry-relevant projects.

Main targets

  • chip design & test
  • chip integration
  • demonstrator integration

Service

  • ASIC design
  • test of digital and mixed-signal-SoCs
  • Measurement of anntenna based systems
  • PCB design
  • chip assembly
  • demonstrator integration

Prof. Miloš Krstić

Department Head

IHP 
Im Technologiepark 25
15236 Frankfurt (Oder)
Germany

Secretary:
Heike Wasgien
Phone: +49 335 5625 342
Fax: +49 335 5625 671 
Send e-mail »

Dalia Hayek
Phone: +49 335 5625 518
Send e-mail »

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