Current Job Offers

Electronics Technician (m/f/d)

Job ID: 8125/25 | Department: Technology | Start: 01.09.2026 | Training duration: 3 ½ years (with very good performance shortening to 3 years possible) | Attractive remuneration according to TVA-L BBiG: Apprenticeship allowance

Further Information in German only  Online Application Form

Mechatronics Technician (m/f/d)

Job-ID: 8124/25 | Abteilung: Technologie | Beginn: 01.09.2026 | Ausbildungsdauer: 3 ½ Jahre (bei sehr guten Leistungen Verkürzung auf 3 Jahre möglich) | Attraktive Vergütung nach TVA-L BBiG: Apprenticeship allowance

Further Information in German only  Online Application Form

Head of Technical Infrastructure Construction and Operations (m/f/d) – Location Cottbus

Job ID: 1035/26 | Department: Executive Management | Salary: as per the TV-L collective bargaining agreement | Work hours: 40 hours/week | Contract term: 2 years with the option of renewal | Start date: as soon as possible

Further Information in German only  Online Application Form

Financial Accounting Associate (m/f/d)

Job ID: 1034/26 | Department: Administrative Services | Salary: as per collective bargaining agreement (TV-L) | Work hours: 40 hours/week (part-time available upon request) | Contract term: 2 years, with the goal of converting to a permanent position | Start date: as soon as possible

Further Information in German only  Online Application Form

Information Security Manager (m/f/d)

Job ID: 1108/25 | Department: D-ITS | Salary: according to collective agreement (TV-L) | Working hours: 40 hours/week | Fixed term: limited to 2 years. Option to extend | Start date: as soon as possible

Further Information in German only  Online Application Form
 

IT System Administrator (m/f/d) with Focus on Storage & Backup

Job-ID: 1084/22

Further Information in German only  Online Application Form

Research Assistant / PhD position (m/f/d) for CMOS- and RRAM-based IMC Architectures: Mixed-Signal Design 

Job-ID: 3035/26 | Department: System Architecture | Working Time: 40h/week| Salary: E13 TV-L | Limitation: 2 years with option of extension | Entry Date: as soon as possible 

The position:
We are looking for a motivated researcher to join the System Architectures Department to mainly work designing and testing CMOS- and RRAM-based IMC architectures manufactured using IHP 130nm CMOS technology, and mainly used for performing Vector Matrix Multiplications (VMMs). Different mixed-signal circuit designs are going to be explored in order to assure the trade-off between performance, power-consumption and reliability. In more detail, these different types of IMC architectures are going to be integrated in an AI platform including not only other AI accelerators, but also a RISC-V that orchestrates AI applications’ execution. It is anticipated, the candidate will work towards a PhD. Your detailed tasks will include: 

• Mixed-signal design and test of CMOS- and RRAM-based IMC architectures
• Layout generation of the designed architectures
• Support in manufacturing and characterization 

Your qualifications:
You hold a Master's degree in computer science, electrical engineering, or a related field. You have good knowledge and experience in mixed-signal design and test and layout generation. Significant experience with mixed-signal design EDA tools is requested. Additionally, knowledge and passion for conventional and non-conventional AI architectures and heterogeneous integration assuming CMOS and novel devices is favorable.
You will also be a strong team player. We are looking for a team member who can structure their own work and bring a well-organized and systematic approach to working with creative minds. You will be an ideal fit for this position if you have experimental, analytical, and problem-solving skills, very strong communication skills, and the ability to quickly learn how to use the latest technical equipment, including various software. You must be fluent in English. 
German language skills are welcome. Further development of German language skills is expected and strongly encouraged, e.g. through in-house language courses and intensive courses. 

Further Information  Online Application Form

R/D Project Coordinator (m/f/d) 

Job-ID: 3032/26 | Department: Material Research | Salary: as per tariff (TV-L) | Working Time: 40h/week | Limitation: initially two years with extension option | Starting Date: as soon as possible 

The position:
The position involves providing structured and proactive support to the Heads of the System Architectures and Circuit Design departments in the planning, application, and implementation of externally funded research projects. The role includes researching and preparing information on national and European funding policies and requirements for applicants, project proposals, and funding bodies. Where appropriate, the successful candidate will design and organize internal information sessions on research funding topics.
Based on the scope of work defined by the respective project managers, the position holder will support project planning activities, including the preparation of project budgets, timelines, and resource analyses. The role further entails facilitating the exchange of project-related information across departments to ensure transparent communication and efficient collaboration.
A key responsibility is the monitoring of project progress, including tracking budgets, schedules, risks, and other relevant project metrics, as well as preparing the organizational sections of project reports. The position also includes proactive guidance and advisory support to applicants throughout the planning, submission, and implementation
phases of externally funded research projects.
In addition, the role involves coordinating necessary measures and liaising with legal advisors in the preparation and execution of cooperation and consortium agreements within national and European collaborative projects. The successful candidate will also organize, coordinate, and participate in national and international kick-off meetings, project meetings, and review meetings. 

Your qualifications:
You have relevant university or master's degree with knowledge of computer science and/or electrical engineering or a related field. A doctorate will be an advantage. You are familiar with the work and organization of a research institution. Ideally you already have experience in science management, especially project management. We need you to be a strong team player, able to effectively plan and execute your own work, and to work in an organized manner with other creative minds. You will be ideally suited for this position if you have very good knowledge of project management and the requirements and structures of national and European research funding.
As IHP is an international research center, it is necessary that you are fluent in English. German language skills are also mandatory. The improvement of German language skills is expected and strongly encouraged, e.g. through in-house language courses and intensive courses. 

Further Information  Online Application Form

Student Assistant (m/f/d) – Scanning Electron Microscopy and Sample Analysis

Job-ID: 70711/26 | Department: Technology | Working Time: 19h/week | Limitation: 3-6 months | Entry Date: as soon as possible | Salary: as per Guideline of the State of Brandenburg on the Working Conditions of Scientific and Student Assistants 

Why this position is interesting
You will support the preparation, execution, and evaluation of electron microscopy investigations on samples from micro- and nanoelectronics. For this purpose, we are looking for a committed Student Assistant (m/f/d) in the field of Scanning Electron Microscopy (SEM).
The position offers practical insight into the preparation, analysis, and evaluation of samples from micro- and nanoelectronics. Depending on your interests and qualifications, there is also the possibility of developing this activity into a study project or thesis, for example in the field of ECCI (Electron Channeling Contrast Imaging). 

Your responsibilities:

• Preparation of samples for investigations using scanning electron microscopy
• Support in carrying out SEM analyses, with the aim of gradually developing towards independent execution
• Evaluation and documentation of acquired measurement and image data
• Performance of supplementary measurements in the context of sample characterisation
• Support in the structured preparation and interpretation of investigation results 

Your qualifications
Required 

• Ongoing university studies, for example in Physics, Electrical Engineering, Materials Science, Microsystems Engineering, Nanotechnology, or a comparable degree programme
• Interest in microscopy, material characterisation, and microelectronic topics
• Careful, structured, and reliable way of working
• Technical understanding and enthusiasm for practical laboratory work
• Good written and spoken German or English skills 

Advantageous 

• Initial knowledge in the field of scanning electron microscopy or material analysis
• Experience with experimental laboratory work
• Interest in the evaluation and interpretation of scientific measurement data
• Basic understanding of imaging principles, in particular with regard to depth of field, contrast, and visual image characteristics 

Further Information  Online Application Form

Research Associate (m/f/d): NanoWired Integration and Packaging Coordination 

Job-ID: 70410/26 | Department: Technology | Salary: as per tarif (TV-L) | Working Time: 40h/week (part-time work option) | Limitation: initially two years with option of extension | Starting Date: as soon as possible

Why this role matters
This position sits at the interface of NanoWired-based low-temperature bonding, advanced packaging, sensor integration, characterization, and open design enablement.
You will help translate technically demanding research results into clear requirements, demonstrator concepts, structured engineering input, and reusable ADK-relevant content. In doing so, you will work closely with internal expert teams in ADK, electrical/RF characterization, sensor integration, packaging, and cleanroom processing, as well as with international partners in Taiwan.
The role combines technical coordination and requirements-transfer tasks from the projects BioBond-AL and ODE4EC-DIG, with a focus on NanoWired integration, packaging and integration constraints, demonstrator support, and reusable engineering input for design enablement.
A mandatory part of this role is project-related work in Taiwan with a total duration of 6 months.

Your mission
You will strengthen the technical coordination between project work, demonstrator implementation, internal expert teams, and external partners. The role is intended for someone who can understand technically demanding topics, structure them clearly, and turn them into robust, usable engineering input.
This is neither a pure hands-on ADK development role nor an operational measurement position. Instead, the role focuses on technical interface work, requirements consolidation, demonstrator-oriented design support, and the transfer of project results into reusable technical artefacts. 

Your responsibilities:

• Derive, structure, and maintain technical requirements, constraints, and decision material for NanoWired integration, advanced packaging, sensor integration, and design-enablement-related topics
• Consolidate technical input from BioBond-AL and ODE4EC-DIG and prepare it as usable input for the internal ADK team
• Coordinate technical questions, requirements, and feedback loops between the project teams and the internal ADK and electrical/RF characterization teams
• Support the preparation of simple demonstrator-oriented layouts, test structures, and interposer-related design elements required for the validation of packaging and characterization concepts
• Coordinate the implementation of such structures in close collaboration with the DSE team and the responsible cleanroom and process experts
• Work with internal experts in sensor systems, packaging, integration, and characterization to derive consistent and practically usable technical requirements
• Consolidate results from joining, characterization, demonstrator evaluation, and integration studies into structured specifications and technical documentation
• Assess and document trade-offs, interface constraints, risks, acceptance criteria, and implementation boundaries in a structured and traceable way
• Support the transfer of project results into ADK-relevant artefacts, technical guidelines, datasets, and other reusable engineering outputs
• Contribute to project-related reporting, workshops, dissemination activities, and technical coordination with national and international partners
• Support the technical coordination of cooperation activities with project partners in Taiwan 

Your qualifications:
Required 

• Master’s degree, Diplom, or equivalent university degree in electrical engineering, microsystems engineering, physics, materials science, or a related technical/scientific field
• Strong organisational and communication skills and enthusiasm for coordinating interdisciplinary technical work
• Strong interest in microelectronics integration, advanced packaging, heterogeneous integration, sensororiented system integration, and open design enablement
• Ability to understand complex technical topics quickly and translate them into clear requirements, specifications, and structured decision material
• Sound technical understanding of bonding- and integration-relevant interface topics in microelectronics, including the ability to follow discussions on surface preparation, oxide-related effects, and metallization adaptations for NanoWired-based integration, and to translate such input into practical requirements and technical documentation
• Very good command of English, both written and spoken
• Willingness to undertake mandatory project-related stays in Taiwan with a total duration of 6 months 

Advantageous

• Basic understanding of reliability and qualification approaches such as thermal cycling, humidity, or electromigration
• Basic understanding of electrical and RF characterization and typical measurement and data flows
• Initial experience with simple layout, test-structure, demonstrator, or interposer-related design tasks
• Interest in NanoWired-based low-temperature bonding and its use in sensor-related or heterogeneous integration scenarios
• Experience in requirements engineering, structured technical documentation, or coordination of research and development projects
• Experience working in interdisciplinary or international teams 

You are a strong team player with a structured and reliable way of working. You enjoy bringing order to complex technical topics, interacting with different expert groups, and helping translate research results into concrete technical outputs. 

Further Information  Online Application Form
 

Research Associate / PhD Position (m/f/d) in Advanced Analysis Methods for Photonic Devices and Integrated Sensors 

Job-ID: 7049/26 | Department: Technology | Salary: as per tarif (TV-L) | Working Time: 40h/week (part-time work option) | Limitation: initially two years with option of extension | Starting Date: as soon as possible 

Shape the next generation of photonic analysis methods
We are offering a PhD position at the interface of advanced analytical diagnostics, integrated photonics and sensor development within the Diagnostics, Sensors & Emerging Modules (DSE) group.
This position is built around a highly relevant research question:
How can performance bottlenecks, variability effects, and failure-related phenomena in photonic devices and integrated sensor structures be localized, understood, and translated into better designs and better testability? 

You will work across two complementary research directions within DSE: 

• development of photonic sensor concepts and low-loss silicon nitride (SiN) platforms
• development of advanced analytical and fault-localization methods 

A key strength of the role is the close connection between photonic device design, experimental analysis, method development, and ongoing research projects in photonic sensing. 

Your research focus
Your PhD will focus on the development of advanced analytical methods for the localization and investigation of performance bottlenecks and failures in photonic devices and integrated sensors.
A particular methodological emphasis lies on laser and optical-based analysis techniques. Starting from methods such as PLS, LVP, LVI, and PEM, you will assess, adapt, and further develop these approaches for photonic applications.
To support this work, you will also design and evaluate dedicated photonic test structures and selected photonic building blocks, for example SiN-based couplers. This creates a direct link between photonic design, experimental validation, and analytical method development. 
The position also directly supports ongoing R&D projects in photonic sensing by contributing targeted design capabilities for photonic devices and test structures. In this way, your work will help identify critical bottlenecks in performance, testability, variability, and failure behavior, and feed these insights back into device and technology development. 

Further Information  Online Application Form





 

Technical Purchasing Specialist (m/f/d) – Cleanroom Supplies & Infrastructure in the Technology Department

Job ID: 7048/26 | Department: Technology/Infrastructure | Salary: Based on TV-L | Work hours: 40 hours/week (part-time available) | Contract term: 2 years with the option to extend | Start date: As soon as possible

Further Information in German only  Online Application Form

Research Associate/PhD Position (m/f/d) for Al-Al Wafer Bonding Technology Development for BiCMOS Wafer-level Packaging Applications 

Job-ID: 7037/26 | Department: Technology | Salary: E13 TV-L | Working Time: 40h/week (part-time option possible) | Limitation: initially for 2 years with option of extension | Starting Date: as soon as possible 

The position:
As a member of the research group "Heterogeneous Integration of Devices & Technologies" within the department Technology you will contribute to a wide range of research activities in the field of high frequency advanced packaging and heterogeneous integration of SiGe BiCMOS technologies for mm-wave up to THz applications. Your tasks will include the development of process technologies and modules using IHPs 200 mm BiCMOS pilot line and IHP advanced Al-Al wafer bonding process technologies. In addition, you will contribute to the design and FEM simulations, and the characterization of advanced wafer-level packaging and interconnection technologies. An international team of 9 scientists, PhD students and engineers is looking forward to you. Flat hierarchies and mutual
support are important to us. We see diversity of perspectives as a great advantage for our team.
Your work is suitable both for a research associate or a PhD project. In case of a PhD project, your work is supported by an experienced supervisor and accompanied within the framework of a supervision agreement. We aim together for a completion within 3-5 years. After one and a half years, the topic will be finally defined and the contract duration will be adjusted accordingly by mutual agreement to the foreseeable doctoral period. 

Your tasks:

• Process development of wafer-to-wafer and chip-to-wafer Al-Al bonding interconnection technologies based on IHPs BiCMOS wafer-level packaging technologies
• Process development and process integration within IHPs 200 mm BiCMOS pilot line
• Design and layout of process control monitor test structures for process development and characterization
• Electrical (e.g. DC, RF) and offline characterization (e.g. SEM, FIB) of developed process modules and components
• Support the development of reliability characterization of BiCMOS wafer-level packaging technologies
• Project support and dissemination of research results within high-level scientific journals and conferences 

Your qualifications: 

• Completed university degree (Master/Diploma) in Electrical Engineering, Material Science, or a related field
• Knowledge about semiconductor process technologies with focus on BEOL and wafer-level packaging technologies
• Theoretical and practical experience of wafer-to-wafer and chip-to-wafer thermo-compression and hybrid bonding
• Extensive hands-on experience with FEM simulation tools (e.g. ANSYS Workbench)
• Ability to work independently in a structured and solution-oriented manner
• Team player with strong communication skills and high self-motivation
• German and English language skills mandatory, both written and spoken 

Further Information  Online Application Form

System administrator (m/f/d) for technical operations

Job ID: 7036/26 | Department: D-T | Salary: according to collective agreement (TV-L) | Working hours: full-time | Fixed-term contract: 2 years with option to extend | Start date: as soon as possible

Further Information in German only  Online Application Form

Group Leader (m/f/d) Process Integration

Job-ID: 70811/25 | Department: Technology | Salary: as per tariff (TV-L) | Working Time: 40h/week | Limitation: initially 2 years with option of extension | Starting Date: as soon as possible

The position:
At IHP, we research and develop cutting-edge silicon-based technologies for high-performance microelectronics. Our Process Integration group is a key part of the Technology Department, driving innovations in SiGe heterojunction bipolar transistors (HBTs), germanium photodiodes, and modulators for applications in the sub-terahertz and highspeed optical communication domains. We are currently looking for an experienced and visionary Group Leader (f/m/d) to lead and advance our process integration activities.
As the head of the Process Integration group, you will take scientific and strategic responsibility for three core teams:

• Device & Technology Development
  Develop and optimize semiconductor devices for integration into IHP's advanced 130 nm SiGe BiCMOS technology platform. Guide research in device physics, TCAD simulation, reliability studies, and yield optimization according to industrial standards
• Electrical Characterization
  Oversee a state-of-the-art measurement laboratory focusing on DC and RF characterization, compact modeling, and statistical process control (SPC) of processed silicon wafers
• Process Control & Prototype Production
  Support multi-project wafer (MPW) production and prototype runs. Analyze process data and electrical results (PCM), identify failures, and implement improvements to ensure robust process stability and yield

You will be responsible for:

• Defining goals, monitoring progress, and evaluating results in close cooperation with your team and other departments
• Strategically shaping research directions and aligning them with industry trends in high-frequency electronics, optoelectronics, and IC manufacturing
• Guiding and developing your team, conducting performance reviews, and fostering a culture of collaboration and innovation

Your qualifications:
You have proven leadership experience in managing scientific and technical teams. This includes advanced competencies in employee development, conflict resolution, strategic planning, and performance assessment. Your strong scientific background lies in solid-state physics, semiconductor device physics, and silicon-based microelectronics. You bring hands-on experience in semiconductor technology development, with in-depth knowledge of cleanroom processes, device simulation, and electrical characterization. You possess a sound understanding of current trends in RF and microwave engineering, communications technology, and photonic integration. You are fluent in English, both spoken and written; German language skills are considered an asset or should be developed with support.

Further Information  Online Application Form
 

Service Technician (m/f/d) in Shiftwork

Job-ID: 6011/25 | Abteilung: Technologie | Gehalt: TV-L EG 6 bis 9, je nach Verantwortungsbereich; Vorerfahrung wird anerkannt | Arbeitszeit: 40h/Woche | unbefristet | Eintrittsdatum: zum nächstmöglichen Zeitpunkt

Further Information in German only  Online Application Form

Technical employee (m/f/d) in continuous alternating shift operation

Job-ID: 7011/25 | Department: Technology | Salary: according to collective labour agreement (TV-L) | Working hours: 40h/week | Fixed term: unlimited | Starting date: as soon as possible

Further Information in German only  Online Application Form

Bachelor's or Master's Thesis (m/f/d): Collection and Systematic Analysis of Customer Satisfaction

Job ID: 9044/26 | Department: Quality Management | Hours: up to 19 hours/week | Duration: 3–6 months | Start date: as soon as possible

Further Information in German only  Online Application Form
 

Student Assistant (m/f/d) for PR & Content Management

Job-ID: 9043/26 | Abteilung: Geschäftsführung | Arbeitszeit: bis zu 19h/Woche | Befristung: zunächst 6 Monate, Verlängerung geplant | Eintrittsdatum: zum nächstmöglichen Zeitpunkt | Vergütung: 13,98 € - 19,81 € 

Further Information in German only  Online Application Form

Science Management Officer (m/f/d)

Job ID: 9113/25 | Department: Management | Salary: E13 TV-L; depending on professional experience, specialist profile, and individual suitability there is the possibility of classification above this level within the collective agreement | Working hours: 40 hours/week | Fixed term: 2 years with option to extend | Start date: as soon as possible

Further Information in German only  Online Application Form

Patent Management and Technology Transfer

Job ID: 9125/24 | Department: Management | Salary: according to collective agreement (TV-L) | Working hours: 40h/week (part-time possible) | Fixed term: for 2 years with option to extend the term | Starting date: as soon as possible

Further Information in German only  Online-Bewerbungsformular