Material Analysis & Metrology

The Off-Line Characterization research group supports research activities at IHP by a broad portfolio of analytical tools and techniques.

Main targets

Our analytical capabilities are employed in the following areas:

  • visualization of surface and cross-section morphology of IC's
  • contamination analysis of Si-Wafer (quantification and mapping)
  • depth profile analysis of dopants (quantification and profile shape)
  • thickness and stoichiometry measurements of thin films
  • strain and crystallinity analysis of epitaxial layer
  • surface analysis of organic contaminants
  • failure analysis of IC's
  • circuit modification

Research topics

  • physical- and chemical material analysis
  • characterization and diagnostics

An accurate analytical characterization of the devices and integrated circuits designed and manufactured at IHP is a key factor for their high performance. We develop and adapt analytical characterization concepts suited for BiCMOS and photonic technologies. A comprehensive IC's characterization is achieved by depth profiling, high-resolution imaging and elemental mapping. Besides analytical characterization failure analysis plays an important role in our activity. It is accompanied in many cases by circuit modification which helps to eliminate iterative cycles of prototype testing and mask modification.

Research results

Dr. rer. nat. Ioan Costina

IHP
Im Technologiepark 25
15236 Frankfurt (Oder)
Germany

Phone: +49 335 5625 370
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The Off-Line Characterization group provides a reliable support platform for technology development and research activities in IHP, by:

  • delivering high quality analytical characterization of Si wafers and ICs
  • contributing to the stabilization and further development of the IC manufacturing process
  • solving yield-reducing problems by failure analysis and circuit modification
  • qualifying new tools and matching recipes

The Off-Line Characterization group provides a reliable support platform for technology development and research activities in IHP, by:

  • delivering high quality analytical characterization of Si wafers and ICs
  • contributing to the stabilization and further development of the IC manufacturing process
  • solving yield-reducing problems by failure analysis and circuit modification
  • qualifying new tools and matching recipes

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