Material analysis and Metrology

Material analysis and Metrology group supports research activities at IHP by a broad portfolio of analytical tools and techniques. Our analytical capabilities are employed in the following areas:

  • Visualization of surface and cross-section morphology of IC's
  • Contamination analysis of Si-Wafer (quantification and mapping)
  • Depth profile analysis of dopants (quantification and profile shape)
  • Thickness and stoichiometry measurements of thin films
  • Strain and crystallinity analysis of epitaxial layer
  • Surface analysis of organic contaminants
  • Failure analysis of IC's
  • Circuit modification

Overview of Analytical Methods »

Dr. Ioan Costina

Im Technologiepark 25
15236 Frankfurt (Oder)

Phone: +49 335 5625 370
Send e-mail »

The website is designed for modern browsers. Please use a current browser.