Our research group develops compact, multifunctional microsystems with enhanced performance and functionality. We combine expertise in materials and devices, multiphysics FEM modelling and simulation, semiconductor processing and assembly technologies.
Our goal is to develop novel components and technology modules, with a particular focus on millimeter-wave and sub-THz applications. Through projects funded by the BMFTR, DFG and EU, we advance research in packaging and heterogeneous integration at IHP.
The HDT group operates a 200 mm pilot line for temporary and permanent wafer bonding—key technologies for advanced packaging and heterogeneous integration. Its capabilities include carrier-wafer handling, low-temperature SiO₂–SiO₂ fusion bonding, Al–Al thermocompression bonding, wafer thinning and related measurement techniques.
Research relevance and application areas
Advanced packaging and heterogeneous integration are gaining importance as conventional semiconductor scaling approaches the limits of Moore’s Law. These technologies are essential for applications ranging from high-performance computing and communications to automotive and medical systems.
RF packaging is particularly critical for emerging millimeter-wave and sub-THz applications, including broadband 6G communications, radar and imaging. While semiconductor performance continues to improve, overall system performance is increasingly constrained by integration. Overcoming these limitations requires novel high-frequency packaging components and technologies.
Main research objectives
RF Packaging
- Advanced packaging solutions for SiGe BiCMOS 2.5/3D-integration
- High performance and fine pitch interconnection technologies for high frequency applications
- Passive and active multi-functional silicon interposer technologies
Heterogeneous Integration
- Combination of SiGe BiCMOS with scaled CMOS and III-V technologies
- Wafer-to-wafer and chip-to-wafer integration techniques
- Heterogeneous integration as alternative for monolithic integration techniques
RF Components
- Implementation of passive RF components in package technologies
- Antenna-in-package integration for single antennas and antenna arrays
- RF interconnections for advanced packaging and heterogeneous integration
Research areas
RF Packaging
The research area RF packaging addresses the development of advanced packaging technologies and solutions for 2.5/3D-integration for mm-wave and sub-THz applications. Fan-in and fan-out wafer-level packaging technologies are highly sought-after as chiplet integration platforms. Passive and active silicon interposer technologies play a major role for IHPs advanced BiCMOS wafer-level packaging platforms. Advanced interconnection technologies, including Al–Al bonding and through-silicon vias (TSVs), enable the integration of IHP’s SiGe BiCMOS technologies for applications operating at frequencies of 300 GHz and above. The group also develops collaborative integration platforms with external research partners.
Heterogeneous Integration
Advanced packaging technologies enable the heterogeneous integration of different technologies and functionalities. The integration and interconnection methods used can be broadly divided into wafer-to-wafer and chip-to-wafer approaches. Examples include the combination of IHPs SiGe BiCMOS technology and III-V technologies (e.g. InP, InGaAs), as well as the combination of SiGe BiCMOS with scaled CMOS. We are also evaluating novel hybrid integration approaches for the combination of SiGe BiCMOS and photonic integrated circuit technologies.
Passive Components
Mm-wave and sub-THz applications often require dedicated passive high frequency components like RF transmission lines, transitions, filters, couplers, antennas and antenna arrays. Within this research area, we address the design and integration of these components. A specific focus is on the integration of antennas based on Antenna-in-Package (AiP) integration technologies. One example is a silicon interposer with embedded dielectric resonator antennas operating in the D- and H-bands, enabling scalable, high-performance antenna arrays for beam-steering applications.
