Design & Test Methodology

The research group Design & Test Methodology deals with topics in the areas of ASIC design, test methods on chip and wafer, and chip integration in package or on PCB. This group is focused on providing the services to internal or external customers or working on the applied industry-relevant projects.

Main targets

  • chip design & test
  • chip integration

Research topics

  • ASIC design of complex digital circuits or circuit-blocks
    • model-based design methodology
    • asynchronous and GALS design
    • radhard ASIC design
    • test of digital and mixed-signal circuits
  • bare die mounting/wire bonding
  • PCB Assembly
  • radhard digital interfaces
  • radhard design of digital circuits


  • ASIC design
  • test of digital and mixed-signal-SoCs
  • PCB design
  • chip assembly

Prof. Miloš Krstić

Department Head

Im Technologiepark 25
15236 Frankfurt (Oder)

Heike Wasgien
Phone: +49 335 5625 342
Fax: +49 335 5625 671 
Send e-mail »

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