MPW Schedule 2021 & 2022 and Price Information 2021

General Technology Description

IHP offers standard 0.13 and 0.25 μm CMOS processes which provide NMOS, PMOS, isolated NMOS and passive components such as poly resistors and MIM capacitors. In addition to the standard CMOS processes different front-end-of-line options are offered. In 0.25 μm CMOS the standard backend offers 3 thin metal layers and two TopMetal layers (TopMetal1 - fourth 2 μm thick metal layer, TopMetal2 – fifth 3 μm thick metal layer). The backend for 0.13 μm process offers 5 thin and 2 thick metal layers (TM1: 2 μm TM2: 3 μm). Together with a high dielectric stack this enables increased performance of the passive RF components.

Technologies with an enhanced BEOL option with copper are offered.

Technologies for MPW & Prototyping

SG13S A high-performance 0.13 µm BiCMOS with npn-HBTs up to fT / fmax= 250/340 GHz, with 3.3 V I/O CMOS and 1.2 V logic CMOS.
SG13G2 A 0.13 µm BiCMOS technology with much higher bipolar performance of fT/fmax = 350/450 GHz.
SG13SCu FEOL process SG13S together with 8 layer Cu BEOL option from X-FAB containing 4 thin Cu layers, 2 thick 3 µm Cu layers, a thin Al layer with 2 fF/µm MIM capacitor and a 2.8 µm Al top layer.
SG13G2Cu FEOL process SG13G2 together with 8 layer Cu BEOL option from X-FAB containing 4 thin Cu layers, 2 thick 3 µm Cu layers, a thin Al layer with 2 fF/µm MIM capacitor and a 2.8 µm Al top layer.
SG25H5_EPIC A monolithic photonic BiCMOS technology combining 0.25 µm CMOS, high-performance npn HBTs (fT / fmax = 220/290 GHz), and full photonic device set for C/O-band.
SG25H3 A 0.25 µm technology with a set of npn-HBTs ranging from a higher RF performance (fT/fmax= 110/180 GHz) to higher breakdown voltages up to 7 V.
SGB25V A cost-effective technology with a set of npn-HBTs up to a breakdown voltage of 7 V.
SGB25RH Is a special variant of SGB25V which includes radiation hard IP for space applications. It is not allowed to use Process Design Kit IP together with SGB25V technology.

The backend offers 3 (SG13: 5) thin and 2 thick metal layers (TM1: 2 μm, TM2: 3 μm). 

A cadence-based mixed signal design kit is available. For high frequency designs an analogue Design Kit in ADS can be used. IHP's reusable blocks and IPs for wireless and broadband are offered to support your designs. 

The following Modules are available

LBE The Localized Backside Etching module is offered to remove silicon locally to improve passive properties (available in all technologies).
PIC Includes additional photonic design layers along with BiCMOS BEOL layers on SOI wafers.
TSV An additional option in SG13S and SG13G2 technology that provides RF grounding by vias through silicon to improve RF performance.
MEMRES A fully CMOS integrated memristive module based on resistive TiN / HfO2-x / TiN switching devices in SG13S technology, along with a Process Design Kit including layout and VerilogA simulation model.

 

2.1 MPW Price Information 2021

Non-Commercial Access

For European non-profit and educational institutions, special discounts are offered for research projects via EUROPRACTICE

2.1.1 Prices for Technologies 

Process      Area Price / mm2
SGB25V € 2500
SGB25RH € 3050
SG25H3 € 3800
SG25H5_EPIC € 8000
SG13S € 6300
SG13C € 4500
SG13G2 € 7300
SG13SCu € 6100
SG13G2Cu € 7000

 

2.1.2 Prices for Modules

Module (Process) Price
LBE (all)  € 5000 per order and technology
BEOL (only) 0.13 µm (SG13) € 1000 (per mm2)
SG25_PIC € 3800 (per mm2)
TSV (S, G2) € 7500 per order
MEMRES (SG13S)  € 2500 per Run + € 600 per mm2

 

2.2 MPW Schedule 2021

There is a minimum area requirement of only 0.8 mm2 for all runs with bold shipment times. For all technologies or modules marked in brackets, minimum area order is required. For details see chapter 2.4. TAPE IN time is given in a column “TAPE IN”, while the shipment time in the corresponding table cells.

2.2.1 Schedule for complete technologies

TAPE IN SGB25 SG25 SG13
  V RH** H3 EPIC S (C) SCu G2Cu G2
Jan 11, 21         May 31* Jun 21* Jun 11 Mai 21
Feb 22, 21 Jun 07* (Jun 25)* Jun 02          
Apr 12, 21         (Sep 27)* Aug 26 Sep 10 (Oct 1)*
May 03, 21       Dez 16        
Jul 12, 21         Nov 29* (Dec 7) (Dec 13) Nov 19
Aug 09, 21 Nov 17 Dec 10 Nov 22*          
Sep 27, 21         Feb 10 Feb 10 Feb 25 Mar 15*
Nov 08, 21 *** *** *** Jun 20        
Dez 13, 21         May 16* May 16* May 6 May 24*

* Runs with lower priority
** TAPE IN for digital blocks is 1 month before standard TAPE IN
*** TAPE IN available on special request

Local Backside Etching (LBE) is not offered for EPIC runs. For all the other runs LBE is available and shipment will be 21 days later than the standard shipment. TSV module is available for SG13S and SG13G2 technologies and it leads to a 49 days longer cycle time. MEMRES module is available for July and December TAPE IN for SG13S technology and it leads to a 28 days longer cycle time.

2.2.2 BEOL (only)/SG25_PIC runs

Aluminum Backend of Line Runs are offered in SG13 for testing of passive structures only. Produced
are Metal1 and all layers above. On request Local Backside Etching (LBE) is offered for SG13 BEOL run. SG25_PIC run is offered on photonic substrates and includes active and passive photonic devices.

TAPE IN SG13 SIG_PIC TSV
Mar 15, 21 Jun 2   Aug 24
Aug 16, 21   Dec 20  

There might be internal BEOL or SG25_PIC runs, without confirmed schedule. Feel free to ask our customer support for more details if you are interested to join such a run.

2.3 MPW Schedule 2022

Changes are possible till December 1st 2021.

There is a minimum area requirement of only 0.8 mm2 for all runs with bold shipment times. For all technologies or modules marked in brackets, minimum area order is required. For details see chapter 2.4. TAPE IN time is given in a column “TAPE IN”, shipment time in corresponding table cells.

Schedule for complete technologies

TAPE IN SGB25 SG25 SG13
  V RH** H3 EPIC S (C) SCu G2Cu G2
Nov 08, 21 *** *** *** Jun 20        
Dez 13, 21         May 16* May 16* May 6 May 24*
Mar 21, 22         (Sep 4)* Aug 4 Aug 19 (Sep 9)*
Apr 4, 22 Jul 18* (Aug 5)* Jul 13 Nov 17        
Jul 04, 22         Oct 27* (Nov 29) (Dec 05) Nov 11
Aug 01, 22 Nov 09 Dec 2 Nov 14*          
Sep 19, 22         Feb 2 Feb 2 Feb 17 Mar 07*
Nov 07, 22 *** *** *** Jun 19        
Dez 12, 22         May 21* May 9* May 9* Apr 21

* Runs with lower priority
** TAPE IN for digital blocks is 1 month before standard TAPE IN
*** TAPE IN available on special request

Local Backside Etching (LBE) is not offered for EPIC runs. For all the other runs LBE is available and shipment will be 21 days later than the standard shipment. TSV module is available for SG13S and SG13G2 technologies and for runs with low priority, it leads to a 35 days longer cycle time. MEMRES module is available for July and December TAPE IN for SG13S technology and it leads to a 28 days longer cycle time.

2.4 Information on Minimum Area per MPW Run

There is a minimum area requirement of only 0.8 mm² for selected technologies or module in schedule tables in chapter 2.2 and 2.3. This is valid for all technologies or modules marked with bold shipment times. For all technologies or modules marked with grey italic shipment times in brackets, minimum area order as given in the following table is required. A registration 4 weeks before TAPE out, followed by the confirmation from the foundry, is necessary in this case. By default these additional runs are without priority. A combination of 0.25 μm based runs and 0.13 μm based runs is not possible.

Process Min Area [mm²] Min Area1 for Discount
 SG25H3 18 15
SG25H5_EPIC 10 10
SGB25V 25 17
SGB25RH 25 -
SG13S 10 7
SG13C - -
SG13G2 10 10
SG13SCu 10 10
SG13G2Cu 10 10
SG25_PIC 12 12

1 Ask for special price if you need more than this area for one MPW run.

Delivery

As default 40 diced samples will be delivered. Exceptions are designs using TSV module and SG25_PIC. Here 25 samples will be delivered by default. The delivery includes E-test data and RF measurements.

Back lapping options:

  • 200 µm (no additional fee)
  • 300 µm (no additional fee)
  • 250 µm (additional fee)
  • 150 µm (additional fee)
  • 100 µm (additional fee)
  • 75 µm (for TSV module only)

Hot lots and additional dies are available upon request.

Research Engineering Runs

IHP is offering complete mask sets only for research purpose and prototyping. If customer specific modules are added to a qualified technology, this technology is considered as non-qualified with status “early access”. Prices for Research Engineering Runs can be given upon request.

IHP's General Terms and Conditions »

For further information please contact:

Dr. René Scholz

IHP GmbH 
Im Technologiepark 25 
15236 Frankfurt (Oder) 
Germany 

Phone: +49 335 5625 647
Fax: +49 335 5625 327
Send e-mail »

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