General Technology Description

IHP offers standard 0.13 and 0.25 μm CMOS processes which provide NMOS, PMOS, isolated NMOS and passive components such as poly resistors and MIM capacitors. In addition to the standard CMOS processes different front-end-of-line options are offered. In 0.25 μm CMOS the standard aluminum BEOL backend offers 3 thin metal layers and two TopMetal layers (TopMetal1 - fourth 2 μm thick metal layer, TopMetal2 – fifth 3 μm thick metal layer). The Al-BEOL backend for 0.13 μm process offers 5 thin and 2 thick metal layers (TM1: 2 μm TM2: 3 μm). Together with a high dielectric stack this enables increased performance of the passive RF components.

Technologies with an enhanced copper BEOL option are offered.

Technologies for MPW & Prototyping

A cadence-based mixed signal design kit is available. For high frequency designs an analogue Design Kit in ADS can be used. IHP's reusable blocks and IPs for wireless and broadband are offered to support your designs. 

The following Modules are available

2.1 MPW Price Information 2026

Non-Commercial Access

For European non-profit and educational institutions, special discounts are offered for research projects via EUROPRACTICE. 

2.1.1 Prices for Technologies 

2.1.2 Prices for Modules

2.2 MPW Schedule

There is a minimum area requirement of only 0.8 mm² for all runs with bold shipment times. For all technologies or modules marked in brackets, minimum area order is required. For details see chapter 2.4. TAPE IN time is given in a column “TAPE IN”, shipment time in corresponding table cells.

Schedule for complete technologies

2026

2027

Changes for 2027 schedule are possible till December 1st 2026.

* Runs with lower priority
** Open-Source MPW Runs with special conditions, which you can find here. 

Local Backside Etching (LBE) is not offered for runs with Cu-BEOL from X-FAB. For all the other runs LBE is available and shipment will be 21 days later than the standard shipment. TSV and RDL modules is available for SG13S and SG13G2 technologies and for runs with low priority, it leads to a 35 days longer cycle time for TSV module. 

2.2.1 BEOL (only)/Interposer/PIC runs

There might be internal runs, without confirmed schedule. Feel free to ask our customer support for more details if you are interested in joining such runs.

2.3 Information on Minimum Area per MPW Run

There is a minimum area requirement of only 0.8 mm² for selected technologies or module in schedule tables in chapter 2.2 and 2.3. This is valid for all technologies or modules marked with bold shipment times. For all technologies or modules marked with grey italic shipment times in brackets, minimum area order as given in the following table is required. A registration 4 weeks before TAPE out, followed by the confirmation from the foundry, is necessary in this case. By default these additional runs are without priority. A combination of 0.25 μm based runs and 0.13 μm based runs is not possible.

¹ Ask for special price if you need more than this area for one MPW run.

Delivery

As default 40 diced samples will be delivered. Exceptions are designs using TSV module and SG25_H7PIC. Here 25 samples will be delivered by default. The delivery includes E-test data and RF measurements.

Back lapping options:

• 200 µm (no additional fee)
• 300 µm (no additional fee)
• 250 µm (additional fee)
• 150 µm (additional fee)
• 100 µm (additional fee)
• 75 µm (for TSV module only)

Research Engineering Runs

IHP is offering complete mask sets only for research purpose and prototyping. If customer specific modules are added to a qualified technology, this technology is considered as non-qualified with status “early access”. Prices for Research Engineering Runs can be given upon request.

IHP's General Terms and Conditions »

For further information please contact:

Dr. René Scholz

IHP GmbH 
Im Technologiepark 25 
15236 Frankfurt (Oder) 
Germany 

Phone: +49 335 5625 647
Fax: +49 335 5625 327
Send e-mail »