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External press release: Connect Four: New Semiconductor for Future Computer Chips

The coated Wafer is visually indistinguishable from a conventional one. © Forschungszentrum Jülich / Jenö Gellinek

Researchers at Forschungszentrum Jülich and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a material that has never existed before: a stable alloy of carbon, silicon, germanium, and tin. The new compound, abbreviated as CSiGeSn, opens up exciting possibilities for applications at the interface of electronics, photonics, and quantum technology.

What makes this material special is that all four elements, like silicon, belong to Group IV of the periodic table. This ensures compatibility with the standard manufacturing method used in the chip industry — the CMOS process — a crucial advantage.

To the complete press release of Forschungszentrum Jülich:
FZ Jülich - Connect Four: New Semiconductor for Future Computer Chips

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