The APECS Pilot Line, which was launched as part of the European Chips Act, officially goes into operation. IHP, as a member of the Research Fab Microelectronics Germany (FMD - Forschungsfabrik Mikroelektronik Deutschland), will play its role alongside Fraunhofer-Gesellschaft and Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH) in this pan-European initiative.
Prof. Andreas Mai, Department Head of Technology at IHP, emphasizes: "It is a great success and also a challenge for German microelectronics research as well as for IHP to participate on this ambitious project and to develop new technologies in the field of chiplet integration within APECS."
APECS focuses on heterogeneous integration and addresses the critical need for advanced packaging and integration of different materials and technologies such as CMOS, SiGe and III/V interconnects to enable next generation electronics. This mission aligns perfectly with IHP's expertise in high performance Silicon Germanium (SiGe) technologies.
Read the full details in the FMD press release: apecs.eu/en/news-and-events/press-release.html
